Abstract: The present invention relates to novel polyimide polymers containing certain fluorinated diamine moieties, said polyimide polymers being characterized by excellent dielectric performances. The present invention also relates to the use of said polyimide-based polymers in polymer compositions in microelectronics applications.

Abstract: The present invention provides modified polyaryl ether ketones (PAEK)s having fluorinated moieties incorporated therein. The present invention also relates to a method for covalently attaching fluorinated moieties onto the surface of PAEK, said method comprising reducing the ketone groups of the PAEK to hydroxyl groups to obtain a modified PAEK and then reacting the hydroxyl groups with a compound bearing a fluorinated moiety.

Abstract: Thermoplastic polyamides [polyamides (PA)] comprising (per)fluoropolyether and polyorganosiloxane recurring units are herein disclosed. Thanks to the use of appropriate amounts and ratios of (per)fluoropolyether and polyorganosiloxane monomers in the polymerization, polyamides (PA) are endowed with high hydro- and oleo-repellence, favourable mechanical properties and resistance to stain, which makes them suitable for a variety applications, including the manufacture and/or surface treatment of medical articles, fuel line hoses, miniature circuit breakers, electrical switches, smart devices, devices for printers, and food packagings.