Patents by Inventor Chin Ngiap Heng

Chin Ngiap Heng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8396243
    Abstract: An earphone has a casing that consists of a base housing (12) and a rear housing (10). The base housing and the rear housing enclose the speaker of the earphone and the base housing has an orifice (19) in it so that a wire carrying an audio signal could be provided to the speaker. The base housing is attached to the rear housing using a catch locking mechanism (22, 24). The earphone further includes a ring which fits on the position where the catch lock engages and provides added strength to catch locking mechanism. The earphone is able to withstand a drop from a height of up to 1.8 m with the ring locking mechanism in engaged position on the earphone casing. Furthermore the ring could be easily removed when the earphone requires servicing or repair and reattached for reuse without causing damage to the earphone casing.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: March 12, 2013
    Assignee: Sony EMCS (Malaysia) Sdn. Bhd.
    Inventor: Chin Ngiap Heng
  • Publication number: 20100142746
    Abstract: An earphone has a casing that consists of a base housing (12) and a rear housing (10). The base housing and the rear housing enclose the speaker of the earphone and the base housing has an orifice (19) in it so that a wire carrying an audio signal could be provided to the speaker. The base housing is attached to the rear housing using a catch locking mechanism (22, 24). The earphone further includes a ring which fits on the position where the catch lock engages and provides added strength to catch locking mechanism. The earphone is able to withstand a drop from a height of up to 1.8 m with the ring locking mechanism in engaged position on the earphone casing. Furthermore the ring could be easily removed when the earphone requires servicing or repair and reattached for reuse without causing damage to the earphone casing.
    Type: Application
    Filed: December 8, 2009
    Publication date: June 10, 2010
    Applicant: Sony EMCS (Malaysia) Sdn. Bhd.
    Inventor: Chin Ngiap Heng