Patents by Inventor Chiou Shoei Chee

Chiou Shoei Chee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metrics for asymmetric wafer shape characterization
    Patent number: 11393118
    Abstract: Using data about the geometry of the wafer, the geometry of the wafer is measured along at least three diameters originating at different points along a circumference of the wafer. A characterization of the geometry of the wafer is determined using the three diameters. A probability of wafer clamping failure for the wafer can be determined based on the characterization.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: July 19, 2022
    Assignee: KLA CORPORATION
    Inventors: Shivam Agarwal, Priyank Jain, Yuan Zhong, Chiou Shoei Chee
  • METRICS FOR ASYMMETRIC WAFER SHAPE CHARACTERIZATION
    Publication number: 20200402252
    Abstract: Using data about the geometry of the wafer, the geometry of the wafer is measured along at least three diameters originating at different points along a circumference of the wafer. A characterization of the geometry of the wafer is determined using the three diameters. A probability of wafer clamping failure for the wafer can be determined based on the characterization.
    Type: Application
    Filed: June 9, 2020
    Publication date: December 24, 2020
    Inventors: Shivam Agarwal, Priyank Jain, Yuan Zhong, Chiou Shoei Chee