Patents by Inventor Chip Akins

Chip Akins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPOSITIONS, METHODS AND SYSTEMS FOR EXTERNAL AND INTERNAL ENVIRONMENTAL SENSING
    Publication number: 20160252325
    Abstract: The present invention relates to compositions, methods and systems for environmental sensing. In particular, the present invention provides compositions, methods and systems for external and internal environmental sensing wherein the sensing provides ultrasonic wind detection sensing.
    Type: Application
    Filed: October 8, 2014
    Publication date: September 1, 2016
    Inventors: Dennis J. Sammut, Lawrence Chao, Chip Akins, Michael Collins
  • High efficiency LED lighting
    Patent number: 8648547
    Abstract: An LED lighting system may include one or more light-emitting diodes and one or more power management modules. Components of the LED lighting system may be selected and arranged, for example, to match a load voltage to an operating voltage. Matching the load voltage to the operating voltage may enable efficient use of power by the LED lighting system. A method of selecting components of the LED lighting system is provided. For example, the components may be selected based on a target luminance and a given operating voltage. The method may be facilitated and/or implemented with a computer.
    Type: Grant
    Filed: November 9, 2010
    Date of Patent: February 11, 2014
    Assignee: Uni-Light LLC
    Inventor: Chip Akins
  • LED thermal management
    Patent number: 8476645
    Abstract: Thermal management solutions for higher power LEDs. In accordance with embodiments, a heat sink, preferably copper, is connected directly to the thermal pad of an LED. Directly connecting the LED thermal pad to the copper heat sink reduces the thermal resistance between the LED package and the heat sink, and more efficiently conducts heat away from the LED through the copper heat sink. In embodiments, the copper heat sink is directly soldered to the LED thermal pad.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: July 2, 2013
    Assignee: Uni-Light LLC
    Inventors: Gary A. McDaniel, Chip Akins
  • LED THERMAL MANAGEMENT
    Publication number: 20110278629
    Abstract: Thermal management solutions for higher power LEDs. In accordance with embodiments, a heat sink, preferably copper, is connected directly to the thermal pad of an LED. Directly connecting the LED thermal pad to the copper heat sink reduces the thermal resistance between the LED package and the heat sink, and more efficiently conducts heat away from the LED through the copper heat sink. In embodiments, the copper heat sink is directly soldered to the LED thermal pad.
    Type: Application
    Filed: November 12, 2010
    Publication date: November 17, 2011
    Applicant: Uni-Light LLC
    Inventors: Gary A. McDaniel, Chip Akins
  • HIGH EFFICIENCY LED LIGHTING
    Publication number: 20110109229
    Abstract: An LED lighting system may include one or more light-emitting diodes and one or more power management modules. Components of the LED lighting system may be selected and arranged, for example, to match a load voltage to an operating voltage. Matching the load voltage to the operating voltage may enable efficient use of power by the LED lighting system. A method of selecting components of the LED lighting system is provided. For example, the components may be selected based on a target luminance and a given operating voltage. The method may be facilitated and/or implemented with a computer.
    Type: Application
    Filed: November 9, 2010
    Publication date: May 12, 2011
    Applicant: Uni-Light, LLC
    Inventor: Chip Akins