Patents by Inventor Chip King Tan

Chip King Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LEAD FRAME INCLUDING U-NOTCH
    Publication number: 20170011989
    Abstract: A lead frame includes a die paddle, a first lead, and a U-notch coupling the die paddle to the first lead. The U-notch extends from the die paddle and the first lead. The U-notch is configured to be removed to electrically isolate the first lead from the die paddle.
    Type: Application
    Filed: July 7, 2015
    Publication date: January 12, 2017
    Applicant: Infineon Technologies AG
    Inventors: Chip King Tan, Chan Lam Cha
  • Semiconductor device package and method of making a semiconductor device package
    Patent number: 8912635
    Abstract: A method of manufacturing an electronic device is provided. The method comprises providing a carrier sheet, etching the lead frame material sheet to form a recess on a first surface of the lead frame material sheet, placing an electronic chip into the recess of the carrier sheet, and thereafter, selectively etching a second surface of the lead frame material sheet, the second surface being opposite to the first surface.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: December 16, 2014
    Assignee: Infineon Technologies AG
    Inventors: Chip King Tan, Boon Huan Gooi
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE PACKAGE
    Publication number: 20120068323
    Abstract: A method of manufacturing an electronic device is provided. The method comprises providing a carrier sheet, etching the lead frame material sheet to form a recess on a first surface of the lead frame material sheet, placing an electronic chip into the recess of the carrier sheet, and thereafter, selectively etching a second surface of the lead frame material sheet, the second surface being opposite to the first surface.
    Type: Application
    Filed: November 23, 2011
    Publication date: March 22, 2012
    Applicant: Infineon Technologies AG
    Inventors: Chip King Tan, Boon Huan Gooi
  • Semiconductor device package and method of making a semiconductor device package
    Patent number: 8084299
    Abstract: A method of manufacturing an electronic device is provided. The method comprises providing a carrier sheet, etching the lead frame material sheet to form a recess on a first surface of the lead frame material sheet, placing an electronic chip into the recess of the carrier sheet, and thereafter, selectively etching a second surface of the lead frame material sheet, the second surface being opposite to the first surface.
    Type: Grant
    Filed: February 1, 2008
    Date of Patent: December 27, 2011
    Assignee: Infineon Technologies AG
    Inventors: Chip King Tan, Boon Huan Gooi
  • Integrated circuit package
    Patent number: 8030746
    Abstract: An integrated circuit package includes a substrate and a first semiconductor chip. The first semiconductor chip is provided in a cavity on a first side of the substrate. The package further includes a second semiconductor chip provided on a second side of the substrate. The first semiconductor chip and the second semiconductor chip form a stack.
    Type: Grant
    Filed: February 8, 2008
    Date of Patent: October 4, 2011
    Assignee: Infineon Technologies AG
    Inventor: Chip King Tan
  • INTEGRATED CIRCUIT PACKAGE AND A METHOD OF MAKING
    Publication number: 20090200650
    Abstract: An integrated circuit package includes a substrate and a first semiconductor chip. The first semiconductor chip is provided in a cavity on a first side of the substrate. The package further includes a second semiconductor chip provided on a second side of the substrate. The first semiconductor chip and the second semiconductor chip form a stack.
    Type: Application
    Filed: February 8, 2008
    Publication date: August 13, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventor: Chip King Tan
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE PACKAGE
    Publication number: 20090194854
    Abstract: A method of manufacturing an electronic device is provided. The method comprises providing a carrier sheet, etching the lead frame material sheet to form a recess on a first surface of the lead frame material sheet, placing an electronic chip into the recess of the carrier sheet, and thereafter, selectively etching a second surface of the lead frame material sheet, the second surface being opposite to the first surface.
    Type: Application
    Filed: February 1, 2008
    Publication date: August 6, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Chip King Tan, Boon Huan Gooi