Abstract: A system and method for matching chip and package terminals and for packaging integrated circuits. Various aspects of the present invention may comprise receiving as input a first list of chip terminal identifiers and a second list of package terminal identifiers. The first and second lists may be analyzed with a first string-matching algorithm to determine a first set of matching pairs of chip terminals and package terminals. The first and second lists may also be analyzed with a second string-matching algorithm to determine a second set of matching pairs of chip terminals and package terminals. The first and second sets of matching pairs may be compared to identify common matching pairs between the first and second sets of matching pairs. An indication of the common matching pairs may then be output.

Abstract: A system and method for matching chip and package terminals and for packaging integrated circuits. Various aspects of the present invention may comprise receiving as input a first list of chip terminal identifiers and a second list of package terminal identifiers. The first and second lists may be analyzed with a first string-matching algorithm to determine a first set of matching pairs of chip terminals and package terminals. The first and second lists may also be analyzed with a second string-matching algorithm to determine a second set of matching pairs of chip terminals and package terminals. The first and second sets of matching pairs may be compared to identify common matching pairs between the first and second sets of matching pairs. An indication of the common matching pairs may then be output.

Abstract: The present invention pertains to a method for analyzing a semiconductor chip design for determining potential voltage drop and electromigration problems. Initially, the semiconductor chip design is divided into a plurality of blocks. A block level verification is then performed based on the assumption that full voltage is being supplied to each of the blocks. Next, the blocks are modeled by an equivalent RC network. This RC network is then reduced into a simpler representation. The voltage drops are determined based on the reduced, equivalent model. The blocks are then reanalyzed with the supply voltage input to the blocks reduced according to the calculated voltage drops. Thereby, a more realistic simulation can be achieved.