Patents by Inventor Chirag L. Malkan

Chirag L. Malkan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11114783
    Abstract: A multidrop cable may include multiple nodes electrically coupled thereon. The nodes may each include a respective PCB layer and a respective connector. The connector may provide connection between the transmission lines of the multidrop cable and the PCB layer. The PCB layer may include circuitry to reduce an induced noise of the multidrop cable by adding twist to the respective signals of the transmission lines. The PCB layer may also preserve the characteristic impedance of the multidrop cable by providing inductance in series between the respective signals of the transmission lines.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: September 7, 2021
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Yutao Wang, Wojciech Koczwara, David D. Brandt, Zhentian Xie, Scott T. Griffiths, Mark Davidsz, Chirag L. Malkan