Patents by Inventor Chiraq S. Patel

Chiraq S. Patel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for filling vias
    Patent number: 7449067
    Abstract: A method for filling vias, and in particular initially blind vias, in a wafer, and various apparatus for performing the method, comprising evacuating air from the vias; trapping at least a portion of the wafer and a paste for filling the vias between two surfaces; and pressurizing the paste to fill the vias.
    Type: Grant
    Filed: November 3, 2003
    Date of Patent: November 11, 2008
    Assignee: International Business Machines Corporation
    Inventors: Paul S. Andry, Jon A. Casey, Raymond R. Horton, Chiraq S. Patel, Edmund J. Sprogis, Brian R. Sundlof