Patents by Inventor Chirstopher John Berry

Chirstopher John Berry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110079901
    Abstract: A method of processing a wafer including a plurality of integrated circuit devices on a front side of the wafer, may include thinning the wafer from a back side opposite the front side. After thinning the wafer, a back side layer may be provided on the back side of the thinned wafer opposite the front side, and the back side layer may be configured to counter stress on the front side of the wafer including the plurality of integrated circuit devices thereon. After providing the back side layer, the plurality of integrated circuit devices may be separated. Related structures are also discussed.
    Type: Application
    Filed: December 15, 2010
    Publication date: April 7, 2011
    Inventors: Glenn A. Rinne, Kevin Engel, Julia Roe, Chirstopher John Berry
  • Patent number: 7871899
    Abstract: A method of processing a wafer including a plurality of integrated circuit devices on a front side of the wafer, may include thinning the wafer from a back side opposite the front side. After thinning the wafer, a back side layer may be provided on the back side of the thinned wafer opposite the front side, and the back side layer may be configured to counter stress on the front side of the wafer including the plurality of integrated circuit devices thereon. After providing the back side layer, the plurality of integrated circuit devices may be separated. Related structures are also discussed.
    Type: Grant
    Filed: January 10, 2007
    Date of Patent: January 18, 2011
    Assignee: Amkor Technology, Inc.
    Inventors: Glenn A. Rinne, Kevin Engel, Julia Roe, Chirstopher John Berry