Patents by Inventor Chisa Yokota

Chisa Yokota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7078999
    Abstract: A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a conductive pattern formed as a result of electroforming.
    Type: Grant
    Filed: April 14, 2005
    Date of Patent: July 18, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Eiichi Uriu, Osamu Makino, Hironobu Chiba, Chisa Yokota
  • Publication number: 20050190036
    Abstract: A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a conductive pattern formed as a result of electroforming.
    Type: Application
    Filed: April 15, 2005
    Publication date: September 1, 2005
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Eiichi Uriu, Osamu Makino, Hironobu Chiba, Chisa Yokota
  • Publication number: 20050188529
    Abstract: A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a conductive pattern formed as a result of electroforming.
    Type: Application
    Filed: April 14, 2005
    Publication date: September 1, 2005
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Eiichi Uriu, Osamu Makino, Hironobu Chiba, Chisa Yokota
  • Patent number: 6914510
    Abstract: A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a conductive pattern formed as a result of electroforming.
    Type: Grant
    Filed: June 16, 2004
    Date of Patent: July 5, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Eiichi Uriu, Osamu Makino, Hironobu Chiba, Chisa Yokota
  • Patent number: 6911888
    Abstract: A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a conductive pattern formed as a result of electroforming.
    Type: Grant
    Filed: January 15, 2001
    Date of Patent: June 28, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Eiichi Uriu, Osamu Makino, Hironobu Chiba, Chisa Yokota
  • Patent number: 6911887
    Abstract: A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a conductive pattern formed as a result of electroforming.
    Type: Grant
    Filed: March 15, 2000
    Date of Patent: June 28, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Eiichi Uriu, Osamu Makino, Hironobu Chiba, Chisa Yokota
  • Patent number: 6909350
    Abstract: A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a conductive pattern formed as a result of electroforming.
    Type: Grant
    Filed: January 31, 2003
    Date of Patent: June 21, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Eiichi Uriu, Osamu Makino, Hironobu Chiba, Chisa Yokota
  • Publication number: 20040227609
    Abstract: A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a conductive pattern formed as a result of electroforming.
    Type: Application
    Filed: June 16, 2004
    Publication date: November 18, 2004
    Inventors: Eiichi Uriu, Osamu Makino, Hironobu Chiba, Chisa Yokota
  • Patent number: 6631545
    Abstract: A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a conductive pattern formed as a result of electroforming.
    Type: Grant
    Filed: November 17, 2000
    Date of Patent: October 14, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Eiichi Uriu, Osamu Makino, Hironobu Chiba, Chisa Yokota
  • Publication number: 20030151486
    Abstract: A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a conductive pattern formed as a result of electroforming.
    Type: Application
    Filed: January 31, 2003
    Publication date: August 14, 2003
    Inventors: Eiichi Uriu, Osamu Makino, Hironobu Chiba, Chisa Yokota
  • Publication number: 20020041223
    Abstract: A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a conductive pattern formed as a result of electroforming.
    Type: Application
    Filed: January 15, 2001
    Publication date: April 11, 2002
    Inventors: Eiichi Uriu, Osamu Makino, Hironobu Chiba, Chisa Yokota
  • Publication number: 20010029662
    Abstract: A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a conductive pattern formed as a result of electroforming.
    Type: Application
    Filed: February 25, 1999
    Publication date: October 18, 2001
    Inventors: EIICHI URIU, OSAMU MAKINO, HIRONOBU CHIBA, CHISA YOKOTA
  • Patent number: 6293001
    Abstract: A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a conductive pattern formed as a result of electroforming.
    Type: Grant
    Filed: February 25, 1999
    Date of Patent: September 25, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Eiichi Uriu, Osamu Makino, Hironobu Chiba, Chisa Yokota
  • Patent number: 5647966
    Abstract: A method for producing a conductive pattern includes the steps of forming a mask layer on a conductive base plate, the mask layer having a pattern defining an exposed area of the conductive base plate; forming a conductive pattern on the exposed area of the conductive base plate by electroforming using a plating liquid which substantially maintains the pattern of the mask layer; and transferring the conductive pattern onto a support layer without removing the mask layer.
    Type: Grant
    Filed: October 2, 1995
    Date of Patent: July 15, 1997
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Eiichi Uriu, Osamu Makino, Hironobu Chiba, Chisa Yokota