Abstract: A surface mount quartz crystal oscillator has a package body having a bottom wall and a first frame wall laminated on the bottom wall and having a central opening, a quartz crystal blank accommodated in a recess formed in the package body including the central opening, an IC (integrated circuit) chip accommodated in the recess and having at least an oscillator circuit connected to the crystal blank, and a cover for enclosing the recess to hermetically encapsulating the crystal blank and the IC chip within the recess. The first frame wall has a notch portion partially cut into the outer periphery thereof, such that a terminal formed on a portion of the top of the bottom wall exposes in the notch portion. The exposed terminal is, for example, a testing crystal terminal electrically connected to the crystal blank.

Abstract: A surface mount quartz crystal oscillator has a package body having a bottom wall and a first frame wall laminated on the bottom wall and having a central opening, a quartz crystal blank accommodated in a recess formed in the package body including the central opening, an IC (integrated circuit) chip accommodated in the recess and having at least an oscillator circuit connected to the crystal blank, and a cover for enclosing the recess to hermetically encapsulating the crystal blank and the IC chip within the recess. The first frame wall has a notch portion partially cut into the outer periphery thereof, such that a terminal formed on a portion of the top of the bottom wall exposes in the notch portion. The exposed terminal is, for example, a testing crystal terminal electrically connected to the crystal blank.