Patents by Inventor Chisato Nagamine

Chisato Nagamine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tester device, inspection device, and interconnection board receiving unit for the tester device and inspection device
    Patent number: 7154261
    Abstract: A tester device including a tester section which includes a tester, an interconnection board receiving unit fixed on the tester section, and a light source. The interconnection board receiving unit has first and second interconnection boards electrically connected to the tester in the tester section, and a contact section electrically connecting the second interconnection board to an external probe. A cut section for an optical-path is provided in the second interconnection board. The interconnection board receiving unit supports the second interconnection board so as to provide the cut section at the side of the tester section. The light source is moved between an inspection position at which the light source faces the cut section in the second interconnection board and an escape position at which the light source does not face the second interconnection board.
    Type: Grant
    Filed: October 26, 2004
    Date of Patent: December 26, 2006
    Assignee: Wintest Corporation
    Inventors: Chisato Nagamine, Shigekatsu Maruyama
  • Tester device, inspection device, and interconnection board receiving unit for the tester device and inspection device
    Publication number: 20050116728
    Abstract: A tester device including a tester section which includes a tester, an interconnection board receiving unit fixed on the tester section, and a light source. The interconnection board receiving unit has first and second interconnection boards electrically connected to the tester in the tester section, and a contact section electrically connecting the second interconnection board to an external probe. A cut section for an optical-path is provided in the second interconnection board. The interconnection board receiving unit supports the second interconnection board so as to provide the cut section at the side of the tester section. The light source is moved between an inspection position at which the light source faces the cut section in the second interconnection board and an escape position at which the light source does not face the second interconnection board.
    Type: Application
    Filed: October 26, 2004
    Publication date: June 2, 2005
    Inventors: Chisato Nagamine, Shigekatsu Maruyama