Patents by Inventor Chisato Nonomura

Chisato Nonomura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8355811
    Abstract: A clothing simulation apparatus precisely determines clothing pressure for bringing a clothing into tight contact with a human body. A fitting part 22 divides a paper pattern model into a plurality of elements, imparts dynamic characteristics shown by a fabric model to each element, deforms the paper pattern model by solving the motion equation of each element using a finite element method, and then fits the clothing virtually to a human body model. The fitting part 22 sets a temporary model to cover a predetermined section of the human body model, deforms the paper pattern model to bring the paper pattern model into contact with the temporary model, and thereafter deforms the paper pattern model to bring the paper pattern model into contact with the human body model.
    Type: Grant
    Filed: January 22, 2009
    Date of Patent: January 15, 2013
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Yumiko Isogai, Mariko Matsui, Kiyoshi Negishi, Sonoko Ishimaru, Chisato Nonomura
  • Publication number: 20110022372
    Abstract: A clothing simulation apparatus precisely determines clothing pressure for bringing a clothing into tight contact with a human body. A fitting part 22 divides a paper pattern model into a plurality of elements, imparts dynamic characteristics shown by a fabric model to each element, deforms the paper pattern model by solving the motion equation of each element using a finite element method, and then fits the clothing virtually to a human body model. The fitting part 22 sets a temporary model to cover a predetermined section of the human body model, deforms the paper pattern model to bring the paper pattern model into contact with the temporary model, and thereafter deforms the paper pattern model to bring the paper pattern model into contact with the human body model.
    Type: Application
    Filed: January 22, 2009
    Publication date: January 27, 2011
    Applicant: TOYO BOSEKI KABUSHIKI KAISHA
    Inventors: Yumiko Isogai, Mariko Matsui, Kiyoshi Negishi, Sonoko Ishimaru, Chisato Nonomura
  • Patent number: 6249925
    Abstract: A bridge of shock-absorbing construction is disclosed, which includes horizontal members arranged in series, vertical members supporting the horizontal members, and connectors for connecting the adjacent horizontal members or for connecting the horizontal member and the vertical member, wherein shock absorbers formed from a material with an elastic modulus in flexure over 200 kgf/cm2 and each having a wall structure in a shock-loading direction are disposed on the connectors or at the points of contact between the horizontal members or between the horizontal member and the vertical member.
    Type: Grant
    Filed: June 23, 1998
    Date of Patent: June 26, 2001
    Assignees: Japan Highway Public Corporation, Toyo Boseki Kabushiki Kaisha
    Inventors: Hiromu Ishida, Yasushi Kamihigashi, Kenji Kubota, Tadashi Kanno, Sakashi Kamata, Yujiro Matsuyama, Yoshio Araki, Kiyoshi Negishi, Chisato Nonomura
  • Patent number: 6085878
    Abstract: A resin impact absorber comprising a hollow columnar body having a honeycomb section or a hollow columnar body having a cylindrical shape, the hollow columnar body being made of a resin with a flexural modulus of 500 to 5000 kgf/cm.sup.2, wherein a reaction-compressibility curve at the time of compression in the lengthwise direction of the columnar body satisfies the following conditions: (a) yield strength.gtoreq.100 Tf/m.sup.2 and (b) compression energy absorption.gtoreq.50 Tf.m/m.sup.3. The resin impact absorber of the present invention is small in size and light in weight and exhibits a high impact energy absorption capacity. A site or structure with an impact absorber of the present invention disposed therein can be prevented from remarkable damage or breakage when it receives a high impact force.
    Type: Grant
    Filed: November 12, 1998
    Date of Patent: July 11, 2000
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Yoshio Araki, Sakashi Kamata, Yujiro Matsuyama, Kiyoshi Negishi, Chisato Nonomura
  • Patent number: 5574119
    Abstract: A thermoplastic resin film at least oriented in the transverse direction with minimized bowing phenomenon is provided. The thermal shrinkage stress in the transverse direction of the film satisfies the following formula I, and the thermal shrinkage factor of said film in the transverse direction at a temperature that is 40.degree. C. higher than the glass transition temperature of said resin is 5% or less:(.sigma..sub.2 /.sigma..sub.1).ltoreq.1.0 (I)wherein .sigma..sub.1 is the thermal shrinkage stress (kg/mm.sup.2) of the film in the transverse direction at a temperature that is 70.degree. C. higher than the glass transition temperature of said resin, and .sigma..sub.2 is the thermal shrinkage stress (kg/mm.sup.2) of the said film in the transverse direction at a temperature that is 80.degree. C. lower than the melting temperature of said resin.
    Type: Grant
    Filed: January 23, 1995
    Date of Patent: November 12, 1996
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Toshirou Yamada, Chisato Nonomura
  • Patent number: 5411695
    Abstract: A thermoplastic resin film at least oriented in the transverse direction with minimized bowing phenomenon is provided. The thermal shrinkage stress in the transverse direction of the film satisfies the following formula I, and the thermal shrinkage factor of said film in the transverse direction at a temperature that is 40.degree. C. higher than the glass transition temperature of said resin is 5% or less:(.sigma..sub.2 /.sigma..sub.1).ltoreq. 1.0 (I)wherein .sigma..sub.1 is the thermal shrinkage stress (kg/mm.sup.2) of the film in the transverse direction at a temperature that is 70.degree. C. higher than the glass transition temperature of said resin, and .sigma..sub.2 is the thermal shrinkage stress (kg/mm.sup.2) of the said film in the transverse direction at a temperature that is 80.degree. C. lower than the melting temperature of said resin.
    Type: Grant
    Filed: October 13, 1993
    Date of Patent: May 2, 1995
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Toshirou Yamada, Chisato Nonomura