Patents by Inventor Chitoshi Kawaguchi

Chitoshi Kawaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5330882
    Abstract: The present invention provides an improved process by which dissolved oxygen is effectively removed from a photosensitive resin layer of a photosensitive resin plate. The process comprises preliminarily exposing the photosensitive resin to light to quench oxygen dissolved in said photosensitive resin layer before conducting a main exposure. The photosensitive resin layer is prepared from a photosensitive resin composition which comprises:(a) a polymer binder,(b) a radically polymerizable monomer,(c) a sensitizing dye, and(d) a photopolymerization initiator which is excited by a light of a different wave length from a light exciting the sensitizing dye.The preliminary exposure is conducted with a light only exciting the sensitizing dye and the main exposure is conducted with a light exciting the photopolymerization initiator.
    Type: Grant
    Filed: June 4, 1991
    Date of Patent: July 19, 1994
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Chitoshi Kawaguchi, Seiji Arimatsu, Katsuji Konishi, Kazunori Kanda
  • Patent number: 5317080
    Abstract: Disclosed herein is a polyether acrylamide derivative of the following general formula (I): ##STR1## as well as an active energy ray curable resin composition comprising at least one polyether acrylamide derivative of the above general formula (I) and a cured product produced by curing such an active energy curable resin composition with active energy rays.
    Type: Grant
    Filed: November 23, 1992
    Date of Patent: May 31, 1994
    Assignees: Ajinomto Co., Inc., Nippon Paint Co., Ltd.
    Inventors: Seiji Arimatsu, Chitoshi Kawaguchi, Kazunori Kanda, Yasuhiro Kimura, Masao Honma, Syoichi Asada, Atsushi Mashita, Koji Takeuchi
  • Patent number: 5221589
    Abstract: Disclosed is a photosensitive resin composition which, can be hot melt molding and and is water-developable. The composition does not need the preliminary exposure process and when cured has suitable hardness and printing properties. The photosensitive resin composition comprises;(A) a water soluble or water dispersible polyvinyl alcohol prepared by saponifying a copolymer obtained by copolymerizing 90 to 99.9 mol % of a vinyl ester and 0.1 to 10 mol % of an ionic group-containing monomer; said polyvinyl alcohol having a saponification degree of the vinyl ester unit of 60 to 75 mol % and a hot melt flow starting temperature of 95.degree. to 170.degree. C.,(B) a polymerizable compound prepared by reacting in the presence of an acid catalyst, (i) N-methylol (meth)acrylamide or N-alkoxymethyl (meth)acrylamide and (ii) a compound selected from the group consisting of monoalcohols, polyhydric alcohols, amides, haloalkylamides, aromatic compounds, ureas and mixtures thereof, and(C) a photopolymerization initiator.
    Type: Grant
    Filed: April 3, 1991
    Date of Patent: June 22, 1993
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Osamu Nanba, Chitoshi Kawaguchi, Seiji Arimatsu, Kazunori Kanda
  • Patent number: 5100763
    Abstract: Disclosed is a water-developable photosensitive resin composition capable of hot melt molding, which comprises:(i) a water soluble or water dispersible polyvinyl alcohol prepared by saponifying a copolymer of a vinyl ester and another copolymerizable monomer, which has a saponification degree of the vinyl ester unit of 50 to 70 mol % and a hot melt flow starting temperature of 60.degree. to 130.degree. C.,(ii) a polymerizable monomer, and(iii) a photopolymerization initiator.
    Type: Grant
    Filed: March 12, 1990
    Date of Patent: March 31, 1992
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Koichi Kimoto, Yasushi Umeda, Chitoshi Kawaguchi, Toshitaka Kawanami
  • Patent number: 4935333
    Abstract: Disclosed is a water-developable photosensitive resin composition capable of hot melt molding, which comprises:(i) a water soluble or water dispersible polyvinyl alcohol prepared by saponifying a copolymer which is obtained from copolymerizing 0 to 20 mol % of a monomer not having an ionic group (hereinafter referred to as "nonionic monomer"), 0 to 10 mol % of an ionic group-containing monomer (hereinafter referred to as "ionic monomer") and the remaining amount of a vinyl ester in the presence of a thiolic acid wherein the total content of the ionic monomer and nonionic monomer is 0.1 to 20 mol %; said polyvinyl alcohol having a terminal mercapto group, a saponification degree of the vinyl ester unit of 50 to 70 mol %, and a hot melt flow starting temperature of 60.degree. to 130.degree. C.(ii) a polymerizable monomer, and(iii) a photopolymerization initiator.
    Type: Grant
    Filed: January 15, 1988
    Date of Patent: June 19, 1990
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Koichi Kimoto, Yasushi Umeda, Chitoshi Kawaguchi, Toshitaka Kawanami