Abstract: A method of producing a surface-mount inductor including an external electrode having high fixing strength with respect to an element body even in a high-humidity environment. The method includes the steps of: winding an electrically-conductive wire to form a coil; forming a core using a sealant primarily containing a metal magnetic powder and a resin in such a manner as to encapsulate the coil in the sealant while allowing each of opposite ends of the coil to be at least partially exposed on a surface of the core; reducing smoothness of a surface of at least a part of a portion of the core on which an external electrode is formed as compared to a surface therearound; and forming the external electrode on the core in such a manner as to be electrically conducted with the coil.

Abstract: [Technical Problem] This invention provides a surface-mount inductor that is capable of positioning a coil in a predetermined position in a mold, thereby to position the coil in a predetermined position of a core and to prevent led-out ends from being buried in the core. [Solution to the Problem] A surface-mount inductor of the present invention comprises: a coil formed by winding a winding wire; and a core containing a magnetic powder and including the coil therein. The coil has opposite led-out ends, each of which is exposed on respective ones of opposed side surfaces of the core. Each of the led-out ends of the coil is connected to an external electrode formed on the core.

Abstract: A method of producing a surface-mount inductor by encapsulating a coil with an encapsulation material containing a resin and a filler using a mold die assembly is provided. In the method, a tablet and a coil are used. The tablet is prepared by preforming the encapsulation material into a shape having a flat plate-shaped portion and a pillar-shaped convex portion on a peripheral thereof. The coil is a wound conductive wire having a cross-section of rectangular-shape. The coil is placed on the tablet to allow both ends of the coil to extend along an outer side surface of the pillar-shaped convex portion of the tablet. The coil and the encapsulation material are integrated together while clamping the both ends of the coil between an inner wall surface of the mold die assembly and the outer side surface of the pillar-shaped convex portion of the tablet, to form a molded body.

Abstract: Process for producing a surface-mount inductor. A forming die assembly comprises a lower die, a first upper die having three peripheral side surfaces and one opening, and a second upper die for closing the first upper die opening, thereby defining a cavity therein. The coil is formed by winding a wire and processing its led-out end such that it contacts with a side surface of the first and second upper dies. The coil is placed in the cavity from the open side of the first upper die such that its led-out end contacts with a side surface of the first and second upper dies. The coil is sealed with a sealant containing a magnetic powder while the first and second upper dies are clamped together, to form the core. An external electrode is formed on the core and the led-out end of the coil is connected to the external electrode.

Abstract: [Object] To provide a method of producing a surface-mount inductor which comprises an external electrode having high fixing strength with respect to an element body even in a high-humidity environment. [Means to Accomplish the Object] The method of producing a surface-mount inductor according to the present invention comprises the steps of: winding an electrically-conductive wire to form a coil; forming a core using a sealant primarily containing a metal magnetic powder and a resin in such a manner as to encapsulate the coil in the sealant while allowing each of opposite ends of the coil to be at least partially exposed on a surface of the core; reducing smoothness of a surface of at least a part of a portion of the core on which an external electrode is formed as compared to a surface therearound; and forming the external electrode on the core in such a manner as to be electrically conducted with the coil.

Abstract: A method of producing a surface-mount inductor by encapsulating a coil with an encapsulation material containing a resin and a filler using a mold die assembly is provided. In the method, a tablet and a coil are used. The tablet is prepared by preforming the encapsulation material into a shape having a flat plate-shaped portion and a pillar-shaped convex portion on a peripheral thereof. The coil is a wound conductive wire having a cross-section of rectangular-shape. The coil is placed on the tablet to allow both ends of the coil to extend along an outer side surface of the pillar-shaped convex portion of the tablet. The coil and the encapsulation material are integrated together while clamping the both ends of the coil between an inner wall surface of the mold die assembly and the outer side surface of the pillar-shaped convex portion of the tablet, to form a molded body.

Abstract: A method of producing a surface-mount inductor by encapsulating a coil with an encapsulation material containing a resin and a filler using a mold die assembly is provided. In the method, a tablet and a coil are used. The tablet is prepared by preforming the encapsulation material into a shape having a flat plate-shaped portion and a pillar-shaped convex portion on a peripheral thereof. The coil is a wound conductive wire having a cross-section of rectangular-shape. The coil is placed on the tablet to allow both ends of the coil to extend along an outer side surface of the pillar-shaped convex portion of the tablet. The coil and the encapsulation material are integrated together while clamping the both ends of the coil between an inner wall surface of the mold die assembly and the outer side surface of the pillar-shaped convex portion of the tablet, to form a molded body.

Abstract: [Technical Problem] This invention provides a surface-mount inductor that is capable of positioning a coil in a predetermined position in a mold, thereby to position the coil in a predetermined position of a core and to prevent led-out ends from being buried in the core. [Solution to the Problem] A surface-mount inductor of the present invention comprises: a coil formed by winding a winding wire; and a core containing a magnetic powder and including the coil therein. The coil has opposite led-out ends, each of which is exposed on respective ones of opposed side surfaces of the core. Each of the led-out ends of the coil is connected to an external electrode formed on the core.

Abstract: A surface-mount inductor according to this invention comprises a coil formed by winding a rectangular conductive wire in an outward spiral pattern (so that opposite ends of the conductive wire become outermost periphery), a core made primarily of magnetic powders and binder, and an external electrode formed on one surface of the core. Further, the surface-mount inductor is characterized by encapsulating the coil in the core so that winding axis of the coil is parallel to the surface of the core on which the external electrode is formed.

Abstract: A method of producing a surface-mount inductor by encapsulating a coil with an encapsulation material containing a resin and a filler using a mold die assembly is provided. A tablet is prepared by preforming the encapsulation material into a shape having a flat plate-shaped portion and a pillar-shaped convex portion on a peripheral thereof A coil is a wound conductive wire having a cross-section of rectangular-shape. The coil is placed on the tablet to allow both ends of the coil to extend along an outer side surface of the pillar-shaped convex portion of the tablet. The coil and the encapsulation material are integrated together while clamping the both ends of the coil between an inner wall surface of the mold die assembly and the outer side surface of the pillar-shaped convex portion of the tablet, to form a molded body.

Abstract: A method of producing a surface-mount inductor by encapsulating a coil with an encapsulation material containing a resin and a filler using a mold die assembly is provided. In the method, a tablet and a coil are used. The tablet is prepared by preforming the encapsulation material into a shape having a flat plate-shaped portion and a pillar-shaped convex portion on a peripheral thereof. The coil is a wound conductive wire having a cross-section of rectangular-shape. The coil is placed on the tablet to allow both ends of the coil to extend along an outer side surface of the pillar-shaped convex portion of the tablet. The coil and the encapsulation material are integrated together while clamping the both ends of the coil between an inner wall surface of the mold die assembly and the outer side surface of the pillar-shaped convex portion of the tablet, to form a molded body.