Abstract: A photomask assembly may be formed such that stress relief trenches are formed in a pellicle frame of the photomask assembly. The stress relief trenches may reduce or prevent damage to a pellicle that may otherwise result from deformation of the pellicle. The stress relief trenches may be formed in areas of the pellicle frame to allow the pellicle frame to deform with the pellicle, thereby reducing the amount damage to the pellicle caused by the pellicle frame.

Abstract: An apparatus for detecting an electronic device testing socket including a testing base, a detecting circuit board, a depth gauge, and a conductive pressing block is provided. The detecting circuit board disposed on the testing base has a carrying surface for carrying an electronic device testing socket. The electronic device testing socket includes a plurality of pin units, and each of the pin units includes an S-shaped pin and a pair of elastic rods accommodated within recesses thereof. The depth gauge disposed on the testing base presses against a top surface of the conductive pressing block, and presses with a bottom surface thereof against the electronic device testing socket. The depth gauge is adapted to adjust a distance between the top surface of the conductive pressing block and the carrying surface. The detecting circuit board is electrically connected to the pin units for detecting the status of the pin units.

Abstract: An apparatus for detecting an electronic device testing socket including a testing base, a detecting circuit board, a depth gauge, and a conductive pressing block is provided. The detecting circuit board disposed on the testing base has a carrying surface for carrying an electronic device testing socket. The electronic device testing socket includes a plurality of pin units, and each of the pin units includes an S-shaped pin and a pair of elastic rods accommodated within recesses thereof. The depth gauge disposed on the testing base presses against a top surface of the conductive pressing block, and presses with a bottom surface thereof against the electronic device testing socket. The depth gauge is adapted to adjust a distance between the top surface of the conductive pressing block and the carrying surface. The detecting circuit board is electrically connected to the pin units for detecting the status of the pin units.

Abstract: A method for re-testing semiconductor device includes following processes: (1) providing a first carrier for accommodating semiconductor devices which have been tested; (2) taking the semiconductor devices out from the first carrier and placing them according to the information of a fist map by a pick-and-place machine, wherein the information of the first map has the coordinates of the positions of the film frame where the semiconductor is to be placed; (3) placing the film frame with the semiconductor devices placed thereon to a testing machine, and re-testing the semiconductor devices according to the information of the first map by the tester; (4) placing the film frame with the semiconductor devices attached thereon to a pick-and-place machine, and taking the semiconductor devices out according to the result of the retesting from the film frame, and placing the semiconductor devices on at least one carriers.

Abstract: A method for re-testing semiconductor device includes following processes: (1) providing a first carrier for accommodating semiconductor devices which have been tested; (2) taking the semiconductor devices out from the first carrier and placing them according to the information of a fist map by a pick-and-place machine, wherein the information of the first map has the coordinates of the positions of the film frame where the semiconductor is to be placed; (3) placing the film frame with the semiconductor devices placed thereon to a testing machine, and re-testing the semiconductor devices according to the information of the first map by the tester; (4) placing the film frame with the semiconductor devices attached thereon to a pick-and-place machine, and taking the semiconductor devices out according to the result of the retesting from the film frame, and placing the semiconductor devices on at least one carriers.