Abstract: A fluid delivery apparatus comprises a first piston body, a second piston body, a fluid delivery pipe, and a sealing element. The first piston body has a first through hole, a first connecting portion, an accommodation space and a buffer space. The second piston body has a second through hole and a second connecting portion disposed inside the accommodation space. The fluid delivery pipe is accommodated in the first through hole and the second through hole, and movable between a first position and a second position. The sealing element encircles the fluid delivery pipe. When the fluid delivery pipe is at the first position, the sealing element is accommodated in the accommodation space. When the fluid delivery pipe is at the second position, a first part of the sealing element is accommodated in the accommodation space, and a second part of the sealing element is accommodated in the buffer space.

Abstract: A LTPS TFT and a TFT substrate are disclosed. The LTPS TFT includes: a substrate; a first gate arranged on the substrate; a polysilicon layer arranged on the substrates, and the polysilicon layer covers the first gate, wherein the polysilicon layer comprises a source area, a drain area, and a trench area formed between the source area and the drain area; a second gate arranged on the polysilicon layer; wherein when the LTPS TFT has been driven, the first gate and the second gate are respectively applied with a first voltage and a second voltage, and a polarity of the first voltage is opposite to the polarity of the second voltage. In this way, the feed through voltage may be reduced such that the TFT performance is enhanced.

Abstract: A LTPS TFT and a TFT substrate are disclosed. The LTPS TFT includes: a substrate; a first gate arranged on the substrate; a polysilicon layer arranged on the substrates, and the polysilicon layer covers the first gate, wherein the polysilicon layer comprises a source area, a drain area, and a trench area formed between the source area and the drain area; a second gate arranged on the polysilicon layer; wherein when the LTPS TFT has been driven, the first gate and the second gate are respectively applied with a first voltage and a second voltage, and a polarity of the first voltage is opposite to the polarity of the second voltage. In this way, the feed through voltage may be reduced such that the TFT performance is enhanced.

Abstract: Disclosed is a method of manufacturing a storage capacitor having increased aperture ratio: providing a substrate having a metal layer disposed thereon, and said metal layer is covered correspondingly with a first dielectric layer and a second dielectric layer in sequence; forming a photoresist layer with a uniform thickness to cover said second dielectric layer; performing a process of exposure-to-light and development to a portion of said photoresist layer that is correspondingly disposed over said metal layer sequentially, so that its thickness is less than its original thickness; removing said photoresist layer and etching said portion of said second dielectric layer, so that a thickness of said portion of said second dielectric layer is less than its original thickness, and the etching depth of said portion is greater than that of the other remaining portions of said second dielectric layer; and forming an electrode layer on said second dielectric layer.

Abstract: Disclosed is a method of manufacturing a storage capacitor having increased aperture ratio: providing a substrate having a metal layer disposed thereon, and said metal layer is covered correspondingly with a first dielectric layer and a second dielectric layer in sequence; forming a photoresist layer with a uniform thickness to cover said second dielectric layer; performing a process of exposure-to-light and development to a portion of said photoresist layer that is correspondingly disposed over said metal layer sequentially, so that its thickness is less than its original thickness; removing said photoresist layer and etching said portion of said second dielectric layer, so that a thickness of said portion of said second dielectric layer is less than its original thickness, and the etching depth of said portion is greater than that of the other remaining portions of said second dielectric layer; and forming an electrode layer on said second dielectric layer.

Abstract: Disclosed is a method of manufacturing a storage capacitor having increased aperture ratio: providing a substrate having a metal layer disposed thereon, and said metal layer is covered correspondingly with a first dielectric layer and a second dielectric layer in sequence; forming a photoresist layer with a uniform thickness to cover said second dielectric layer; performing a process of exposure-to-light and development to a portion of said photoresist layer that is correspondingly disposed over said metal layer sequentially, so that its thickness is less than its original thickness; removing said photoresist layer and etching said portion of said second dielectric layer, so that a thickness of said portion of said second dielectric layer is less than its original thickness, and the etching depth of said portion is greater than that of the other remaining portions of said second dielectric layer; and forming an electrode layer on said second dielectric layer.