Patents by Inventor Chiu-Feng Yang

Chiu-Feng Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Separating device and method thereof
    Patent number: 8012307
    Abstract: A separating device for separating an electronic main body from a substrate bonded thereto comprises a platform, a conveying section, a dissolving section, a cleaning section, and a first partition plate. The conveying section is disposed on the platform for moving the electronic main body and the substrate forward. The dissolving section is disposed on the platform for spraying a solvent onto the bonded electronic main body and substrate. The cleaning section is also disposed on the platform for cleaning the electronic main body. The first partition plate is located between the dissolving section and the cleaning section and has at least one first slot, which allows only the electronic main body but not the substrate to pass therethrough, so that the electronic main body is separated from the substrate at the first partition plate. A method for separating the electronic main body and the substrate is also provided.
    Type: Grant
    Filed: August 12, 2009
    Date of Patent: September 6, 2011
    Assignee: Asia IC Mic-Process, Inc.
    Inventors: Yuan-Hsin Li, Chiu-Feng Yang
  • SEPARATING DEVICE AND METHOD THEREOF
    Publication number: 20100084093
    Abstract: A separating device for separating an electronic main body from a substrate bonded thereto comprises a platform, a conveying section, a dissolving section, a cleaning section, and a first partition plate. The conveying section is disposed on the platform for moving the electronic main body and the substrate forward. The dissolving section is disposed on the platform for spraying a solvent onto the bonded electronic main body and substrate. The cleaning section is also disposed on the platform for cleaning the electronic main body. The first partition plate is located between the dissolving section and the cleaning section and has at least one first slot, which allows only the electronic main body but not the substrate to pass therethrough, so that the electronic main body is separated from the substrate at the first partition plate. A method for separating the electronic main body and the substrate is also provided.
    Type: Application
    Filed: August 12, 2009
    Publication date: April 8, 2010
    Inventors: Yuan-Hsin LI, Chiu-Feng Yang