Patents by Inventor Chiu-Fong Huang

Chiu-Fong Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050056373
    Abstract: A reciprocating type protective cover sheet adhering machine is constructed to include a machine base, a material feeder adapted to place plate members on the table of the machine base in a stack, and a cover sheet applicator unit, the cover sheet applicator unit including an applicator body to be reciprocated along a track above the machine base below to apply a protective cover sheet to the top and bottom sides of each plate member being carried by the material feeder to the table of the machine base.
    Type: Application
    Filed: September 17, 2003
    Publication date: March 17, 2005
    Inventor: Chiu-Fong Huang
  • Publication number: 20040074358
    Abstract: An apparatus for processing binding film is provided. The apparatus comprises a workstation board and a feeder for supplying the binding film, wherein the feeder is disposed at a front-end side of the workstation board. A separating set comprising a metering roller and a plurality of knifes, a slot-flush set comprising a plurality of flushing heads, and a knife set, are disposed at predetermined positions over the workstation board. The slot flushing, separation and cutting process steps are executed in a single step. A receiving section is disposed at a distal end side of the workstation board and behind the knife set. The processed binding film sheets are automatically received and stacked.
    Type: Application
    Filed: October 21, 2002
    Publication date: April 22, 2004
    Applicant: USUN TECHNOLOGY CO., LTD.
    Inventor: Chiu-Fong Huang
  • Patent number: 6541736
    Abstract: The present invention provides a circuit board/printed circuit board having pre-reserved conductive heating circuits, which comprises a plurality of metal circuit substrates and a plurality of layers of insulating material. The conductive heating circuits are disposed on the metal circuit substrates. Each of the conductive heating circuits has a plurality of direct heat-generating regions. The insulating material is disposed between the metal circuit substrates. When a current is provided to the conductive heating circuits, heat required for partly bonding and hardening can be generated so that the insulating material and the corresponding positions of the direct heat-generating regions on the metal circuit substrates can be bonded and hardened together. A pre-stacked multi-layer metal circuit board with partly bonding and hardening is thus finished.
    Type: Grant
    Filed: December 10, 2001
    Date of Patent: April 1, 2003
    Assignee: Usun Technology Co., Ltd.
    Inventors: Chiu Fong Huang, Chung-Shan Chen
  • Patent number: D460330
    Type: Grant
    Filed: September 26, 2001
    Date of Patent: July 16, 2002
    Inventor: Chiu-Fong Huang