Patents by Inventor CHIU-HSIEN YANG

CHIU-HSIEN YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PLATED PRODUCT AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20190378632
    Abstract: A plated product includes a component and an overall layer plated on a surface of the component. The overall layer includes a copper layer, a nickel layer, a nickel-tungsten layer, an inner golden layer, a palladium layer, an outer golden layer and a rhodium-ruthenium layer. The copper layer is plated on a surface of the component. The nickel layer, the nickel-tungsten layer, the inner golden layer, the palladium layer, the outer golden layer and the rhodium-ruthenium layer are plated on a surface of the copper layer in sequence.
    Type: Application
    Filed: May 13, 2019
    Publication date: December 12, 2019
    Inventors: CHIU-HSIEN YANG, QI-WEN XIAO, PENG LI