Abstract: A carrier structure is provided, in which at least one positioning area is defined on a chip-placement area of a package substrate, and at least one alignment portion is disposed on the positioning area. Therefore, the precision of manufacturing the alignment portion is improved by disposing the positioning area on the chip-placement area, such that the carrier structure can provide a better alignment mechanism for the chip placement operation.

Abstract: A probe structure for an ear thermometer includes a housing, a sleeve component, a sensor unit and a holding component. The housing has a first containing room to contain the sleeve component having a second containing room. The sleeve component has a front end formed with a reflective surface. The sensor unit is placed inside the second containing room and has a window, via which the sensor unit detects heat radiation. The sleeve component is used to lower heat radiation impact upon the sensor unit and prevent inexact measurements by the sensor unit caused by detecting objects other than the measured object. The sleeve component helps to reflect heat radiation from the measured object to the infrared sensor. This sensor unit functions well even though it is not disposed at the front most end of the probe. The holding component has one end against the bottom of the sensor unit.