Abstract: A fluid delivery apparatus comprises a first piston body, a second piston body, a fluid delivery pipe, and a sealing element. The first piston body has a first through hole, a first connecting portion, an accommodation space and a buffer space. The second piston body has a second through hole and a second connecting portion disposed inside the accommodation space. The fluid delivery pipe is accommodated in the first through hole and the second through hole, and movable between a first position and a second position. The sealing element encircles the fluid delivery pipe. When the fluid delivery pipe is at the first position, the sealing element is accommodated in the accommodation space. When the fluid delivery pipe is at the second position, a first part of the sealing element is accommodated in the accommodation space, and a second part of the sealing element is accommodated in the buffer space.

Abstract: An electronic package is provided, in which a stacking component and a plurality of conductive pillars are embedded in a packaging layer, and a routing structure is formed on the packaging layer, where the stacking component is formed by stacking a first electronic module and a second electronic module on each other, and a plurality of first conductive vias and a plurality of second conductive vias are served as the electrical connection paths between the first electronic module and the second electronic module, such that the transmission distance of electrical signals between a first electronic element in the first electronic module and a second electronic element in the second electronic module can be reduced.

Abstract: An electronic package and manufacturing method thereof are provided, in which an electronic module served as a bridge element and a plurality of conductive pillars are embedded in a packaging layer, a routing structure is formed on the packaging layer, and a plurality of electronic elements are disposed on the routing structure, such that the electronic elements electrically bridge the electronic module via the routing structure.

Abstract: A Fast Non-Maximum Suppression (NMS) Algorithm post-processing for object detection includes getting original data output from a deep learning model inference output, the original data including a plurality of bounding boxes, pre-emptively filtering out at least one bounding box of the plurality of bounding boxes from further consideration when applying the algorithm, the at least one bounding box filtered out according to a predetermined criteria, processing data, using sigmoid functions or exponential functions, from bounding boxes of the plurality of bounding boxes not filtered out to generate processed bounding boxes, calculating final scores of the processed bounding boxes, and choosing a processed bounding boxes utilizing the final scores.

Abstract: A method of manufacturing an electronic package is provided, in which a package module including a routing structure is stacked on a carrier structure via a plurality of conductive elements, a heat dissipation member covers a part of a surface of the routing structure, and an electronic module is disposed on another part of the surface of the routing structure, so that the routing structure is formed with at least one heat dissipation pad bonded to the heat dissipation member, such that the heat energy of the electronic module and the package module can be dissipated via the heat dissipation pad and the heat dissipation member.

Abstract: A Fast Non-Maximum Suppression (NMS) Algorithm post-processing for object detection includes getting original data output from a deep learning model inference output, the original data including a plurality of bounding boxes, pre-emptively filtering out at least one bounding box of the plurality of bounding boxes from further consideration when applying the algorithm, the at least one bounding box filtered out according to a predetermined criteria, processing data, using sigmoid functions or exponential functions, from bounding boxes of the plurality of bounding boxes not filtered out to generate processed bounding boxes, calculating final scores of the processed bounding boxes, and choosing a processed bounding boxes utilizing the final scores.

Abstract: An illuminating device is provided. The illuminating device includes a light source and a lampshade. The light source provides a first light beam and a second light beam. The lampshade includes a first curved surface and a second curved surface. The first light beam is refracted by the first curved surface. The second light beam is reflected by the second curved surface, and a curvature of the first curved surface differs from a curvature of the second curved surface.

Abstract: An illumination apparatus including a light-emitting unit and a lens module is described. The light-emitting unit is used for generating a light and has a light exit axis. The lens module has a light exit surface with a plurality of curved surfaces. The lens module receives the light and outputs the light from the curved surfaces. Further, the curved surfaces have at least two curvatures, each for adjusting a illumination range of the light output from the corresponding curved surface.

Abstract: An illuminating device is provided. The illuminating device includes a light source and a lampshade. The light source provides a first light beam and a second light beam. The lampshade includes a first curved surface and a second curved surface. The first light beam is refracted by the first curved surface. The second light beam is reflected by the second curved surface, and a curvature of the first curved surface differs from a curvature of the second curved surface.

Abstract: An LED package interface inspection apparatus for an LED device comprises a current source, a voltage measuring unit, and a testing control unit. The testing control unit provides at least one control signal to command the current source to output at least one current for the LED device. The testing control unit also provides at least two signals to command the voltage measuring unit to measure a first forward voltage of the LED device at a first time and a second forward voltage of the LED device at a second time. The testing control unit calculates a voltage difference between the first forward voltage and the second forward voltage, and determines that the LED device is defective if the voltage difference is larger than a predetermined threshold value.

Abstract: A life test device comprises an oven, a current source, a voltage meter, a control module, and a process module. A light-emitting diode (LED) is disposed in the oven. The temperature of the oven is gradually changed in a first period and remains at a set temperature in a second period. The current source provides a first current and a second current to the LED. The voltage meter measures forward voltages of the LED. The control module controls the current source to output the first or second current to the LED and controls the voltage meter to measure the forward voltages of the LED. The process module calculates a junction temperature of the LED according to the forward voltages and a variation relationship formula between the forward voltages and the temperature of the oven.

Abstract: A life test device comprises an oven, a current source, a voltage meter, a control module, and a process module. A light-emitting diode (LED) is disposed in the oven. The temperature of the oven is gradually changed in a first period and remains at a set temperature in a second period. The current source provides a first current and a second current to the LED. The voltage meter measures forward voltages of the LED. The control module controls the current source to output the first or second current to the LED and controls the voltage meter to measure the forward voltages of the LED. The process module calculates a junction temperature of the LED according to the forward voltages and a variation relationship formula between the forward voltages and the temperature of the oven.

Abstract: A light emitting apparatus at least includes a light emitting device, a connecting wire structure, and a space-occupation body. The light emitting device is disposed in the space-occupation body, electrically coupled with the connecting wire structure, and emits a first-frequency-range light under a suitable driving voltage. A light emitting surface of the light emitting device structure is covered by a first anti-reflection layer with respect to the first-frequency-range light. A packaging material is filled into the space-occupation body. The packaging material at least includes a luminescent material. The luminescent material is excited by the first-frequency-range light, so as to generate at least a second-frequency-range light.

Abstract: A light emitting diode (LED) package includes at least one LED chip, a carrier, a light reflection element and at least one outside connection electrode. The LED chip is disposed on the carrier and a conductive line or a flip chip method is used to connect the electrodes of the LED chip to the external connection electrodes. A transparent material is used for fixing the light reflection element and carrier, and forming a lens.

Abstract: An illumination apparatus including a light-emitting unit and a lens module is described. The light-emitting unit is used for generating a light and has a light exit axis. The lens module has a light exit surface with a plurality of curved surfaces. The lens module receives the light and outputs the light from the curved surfaces. Further, the curved surfaces have at least two curvatures, each for adjusting a illumination range of the light output from the corresponding curved surface.

Abstract: A light emitting apparatus includes at least including a light emitting device structure, a connecting wire structure, and a space-occupation body. The light emitting device structure is disposed in the space-occupation body, electrically coupled with the connecting wire structure, and emits a first-frequency-range light under a suitable driving voltage. A light emitting surface of the light emitting device structure is covered by a first anti-reflection layer with respect to the first-frequency-range light. A packaging material is filled into the space-occupation body. The packaging material at least includes a luminescent material. The luminescent material is excited by the first-frequency-range light, so as to generate at least a second-frequency-range light.

Abstract: A bar-like side-emitting light guide suitable for re-directing an incident light beam such that the light beam emerges from each side of the structure. The guide structure includes a light guiding bar having an upper surface and a lower surface and extending along a longitudinal direction. On a cross-sectional plane of the light guiding bar, there is a first line interval on the upper surface. A second line interval, a third line interval and a coupling part are located at the lower surface. The coupling part couples with the second line interval and the third line interval. The distance from the lower surface of the light guiding bar to a reference plane of the upper surface varies such that the thickness gradually decreases from the coupling part to the sides. In addition, a planar light source module can be constructed by arranging the foregoing light guiding bars in parallel.

Abstract: The present invention relates to a combined light emitting diode (LED) package structure and a fabricating method for fabricating the same. The combined LED package structure includes an LED chip, a conductive structure and an encapsulant. The encapsulant encapsulates the LED chip and a portion of the conductive structure. The conductive structure has a thick metal member and a thin metal member. The thick metal member is used for carrying the LED chip, provide heat absorbing and heat dissipating paths to the LED chip, the bottom and a portion of the lateral side thereof are exposed to the outside of the encapsulant to increase heat dissipating area. The thin metal member is electrically connected to the LED chip via at least two conductive leads which are extended to a region outside of the encapsulant to serve as outside electrodes of the LED package structure.

Abstract: A bar-like side-emitting light guide suitable for re-directing an incident light beam such that the light beam emerges from each side of the structure. The guide structure includes a light guiding bar having an upper surface and a lower surface and extending along a longitudinal direction. On a cross-sectional plane of the light guiding bar, there is a first line interval on the upper surface. A second line interval, a third line interval and a coupling part are located at the lower surface. The coupling part couples with the second line interval and the third line interval. The distance from the lower surface of the light guiding bar to a reference plane of the upper surface varies such that the thickness gradually decreases from the coupling part to the sides. In addition, a planar light source module can be constructed by arranging the foregoing light guiding bars in parallel.

Abstract: A light emitting diode (LED) package includes at least one LED chip, a carrier, a light reflection element and at least one outside connection electrode. The LED chip is disposed on the carrier and a conductive line or a flip chip method is used to connect the electrodes of the LED chip to the external connection electrodes. A transparent material is used for fixing the light reflection element and carrier, and forming a lens.