Abstract: A carrier structure is provided with a plurality of package substrates connected via connecting sections, and a functional element and a groove are formed on the connecting section, such that the groove is located between the package substrate and the functional element. Therefore, when a cladding layer covering a chip is formed on the package substrate, the groove can accommodate a glue material overflowing from the cladding layer to prevent the glue material from contaminating the functional element.

Abstract: An image recovery method is disclosed for eliminating an effect of an environmental medium. The image recovery method includes receiving a captured image affected by the environmental medium, defining a respective local window with each pixel located at a center of the respective local window, and under an assumption that original radiance of all pixels within the respective local window in the captured image are identical, performing a minimization calculation for each local window, to obtain a corresponding transmission of each pixel in the captured image.

Abstract: An image recovery method is disclosed for eliminating an effect of an environmental medium. The image recovery method includes receiving a captured image affected by the environmental medium, defining a respective local window with each pixel located at a center of the respective local window, and under an assumption that original radiance of all pixels within the respective local window in the captured image are identical, performing a minimization calculation for each local window, to obtain a corresponding transmission of each pixel in the captured image.