Abstract: An optical inspection system includes a brightness inspection module for inspecting the brightness of a light emitting element, an integrated inspection module for inspecting the near field optical characteristic and the beam quality factor of the light emitting element, and a far field inspection module for inspecting the far field optical characteristic of the light emitting element. As a result, the optical inspection system is space-saving and capable of reducing the distance and time of the movement of the device under test.

Abstract: An optical inspection system includes a brightness inspection module for inspecting the brightness of a light emitting element, an integrated inspection module for inspecting the near field optical characteristic and the beam quality factor of the light emitting element, and a far field inspection module for inspecting the far field optical characteristic of the light emitting element. As a result, the optical inspection system is space-saving and capable of reducing the distance and time of the movement of the device under test.

Abstract: A method for stacking and bonding wafers in precision alignment by detecting alignment marks provided on wafer edges, comprising the steps of: (a) providing at least a first wafer having at least a first pattern and at least a second pattern disposed on the cross-section thereof, at least a second wafer having at least a third pattern and at least a fourth pattern disposed on the cross-section thereof, and at least a sensing device, while pairing the first pattern with the third pattern and pairing the second pattern with the fourth pattern; (b) actuating the first wafer and the second wafer for enabling the first to parallel the second wafer and to be a distance apart from the second wafer; (c) actuating the first wafer and the second wafer for bringing the two wafers to move toward each other while enabling the sensing device for detecting and determining whether or not the first pattern is in a position capable of matching with the third pattern and the second pattern in another position capable of matchin

Abstract: The present invention provides an apparatus with surface information displaying, wherein a skin unit comprising a flexible display is covered on the surface of a moving object of the apparatus such that the surface of the apparatus is capable of displaying the information such us color, pattern or text immediately by software control. Meanwhile, the flexible display further has a layer of tactile sensing unit for detecting input of interacting signal. In addition, the moving object further integrates an environmental sensing device, an information identifying device or a combination of both and uses the environmental status, text information or audio/video, which are generated from the environmental sensing device or information identifying device, as an input signal through cable or wireless technology so as to generate responsive action through the flexible display or mechanism of the apparatus so that interactivities of the apparatus can be increased.

Abstract: A tactile sensing for human robot interaction device and a method thereof are provided. The tactile sensing device at least includes a touch interface, a tactile sensor module, a controller, and an actuating unit. The tactile sensor module coupled to the touch interface is used to sense an external touch, so as to generate a series of timing data corresponding to the external touch. The controller coupled to the tactile sensor module is used to receive the series of timing data, and to determine a touch pattern based on a geometric calculation, so as to generate a control signal. The actuating unit coupled to the controller responses an interactive reaction corresponding to the touch pattern based on the control signal.

Abstract: The present invention provides a tactile sensing device comprising a tactile sensing layer, a pressure adjusting unit, at least one pressure sensing unit and a control unit. The tactile sensing layer includes a plurality of elastic elements, each of which has an inner space. The pressure adjusting unit coupled to the tactile sensing layer functions to provide and control variation of the pressure in the inner space of each elastic element. The control unit is coupled to the air supply unit and the at least one pressure sensing unit. The control unit is capable of receiving sensing signal from the at least one pressure sensing unit. In addition, the present invention also provides an apparatus whose surface is covered by the tactile sensing device. With the foregoing disclosure, it is capable of detecting the location and magnitude of the force acted on the tactile sensing device disposed on the surface of the apparatus through sensing the variation of pressure occurred in the elastic elements.

Abstract: The invention provides an apparatus for measuring torque of a torque tool by using an indirect structure arranged on one side of the torque tool, in which the apparatus comprises a microstructure part connected with a side surface of the torque tool. The microstructure part further comprises a sensing structure for sensing the strain or displacement generated by a force exerted on the torque tool and converting the strain or displacement into an electrical signal. The electrical signal is then properly calibrated and processed for transforming units by a System-on-Chip (SoC), and converted into the torque value exerted by the user and the value is displayed on a display device.

Abstract: The invention provides an apparatus for measuring torque of a torque tool by using an indirect structure arranged on one side of the torque tool, in which the apparatus comprises a microstructure part connected with a side surface of the torque tool. The microstructure part further comprises a sensing structure for sensing the strain or displacement generated by a force exerted on the torque tool and converting the strain or displacement into an electrical signal. The electrical signal is then properly calibrated and processed for transforming units by a System-on-Chip (SoC), and converted into the torque value exerted by the user and the value is displayed on a display device.

Abstract: A method for stacking and bonding wafers in precision alignment by detecting alignment marks provided on wafer edges, comprising the steps of: (a) providing at least a first wafer having at least a first pattern and at least a second pattern disposed on the cross-section thereof, at least a second wafer having at least a third pattern and at least a fourth pattern disposed on the cross-section thereof, and at least a sensing device, while pairing the first pattern with the third pattern and pairing the second pattern with the fourth pattern; (b) actuating the first wafer and the second wafer for enabling the first to parallel the second wafer and to be a distance apart from the second wafer; (c) actuating the first wafer and the second wafer for bringing the two wafers to move toward each other while enabling the sensing device for detecting and determining whether or not the first pattern is in a position capable of matching with the third pattern and the second pattern in another position capable of matchin