Patents by Inventor Chiuan-You DING

Chiuan-You DING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package structure having a lead frame and a passive component
    Patent number: 12033923
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a lead frame and passive component. The lead frame includes a paddle and a plurality of leads. The lead frame includes a first surface and a second surface opposite to the first surface. The passive component includes an external connector. A pattern of the external connector is corresponding to a pattern of the plurality of leads of the lead frame.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: July 9, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chi-Tsung Chiu, Hui-Ying Hsieh, Chun Hao Chiu, Chiuan-You Ding
  • SEMICONDUCTOR PACKAGE STRUCTURE
    Publication number: 20220084914
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a lead frame and passive component. The lead frame includes a paddle and a plurality of leads. The lead frame includes a first surface and a second surface opposite to the first surface. The passive component includes an external connector. A pattern of the external connector is corresponding to a pattern of the plurality of leads of the lead frame.
    Type: Application
    Filed: September 16, 2020
    Publication date: March 17, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi-Tsung CHIU, Hui-Ying HSIEH, Chun Hao CHIU, Chiuan-You DING