Patents by Inventor Chiun-Wei Chu

Chiun-Wei Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming cantilever structure in microelectromanical system
    Patent number: 6046066
    Abstract: The present invention relates to a new process of the cantilever structure in the micro-electro-mechanical system (MEMS), and more particularly, to a process that could overcome the contamination problem on the undesired areas during the thin-film growth. Their advantages include not only to substitute the complex technique with sacrificial layer, but also to increase the yield for its simple structure and to deal the sub-micron microelectromechanical system technology for the mature stage on the wet-etching skill.
    Type: Grant
    Filed: March 10, 1998
    Date of Patent: April 4, 2000
    Assignee: National Science Council of Rep. of China
    Inventors: Yean-Kuen Fang, Jyh-Jier Ho, Chiun-Wei Chu