Abstract: A MEMS device, includes: a substrate; at least two driving units, located on the substrate; at least two movable structures, respectively connected to the at least two driving units; and at least two internal mass structures, or at least one internal mass structure and at least two external mass structures, the internal mass structure being connected between the two movable structures, wherein the external mass structures are connected to and located outside the two movable structures. In response to a movement of the MEMS device, the internal mass structure rotates, and the external mass structures move in opposite directions. There is no flexible element directly connecting the mass structures, so as to reduce a coupling effect between the mass structures.

Abstract: A MEMS device includes at least two masses and at least one spring assembly, each of the spring assemblies including at least two folded-shape springs and at least two connection portions. The folded-shape springs are directly connected to each other at a connection point, and the folded-shape springs are respectively connected to the masses through the corresponding connection portions, for operably driving the masses to move simultaneously inward or outward in a first direction.

Abstract: A MEMS (Micro-Electro-Mechanical System) device includes: a substrate, including an anchor; a proof mass, including a centroid, wherein there is a distance between the centroid and the anchor; at least two spring assemblies, connected between two opposite sides of the anchor and the proof mass, to assist a motion of the proof mass; and plural sensing capacitances, located between the substrate and the proof mass to operably sense the motion of the mass; wherein each of the spring assemblies includes a parallel-swing spring and a compression spring which are serially connected to each other.

Abstract: A fluid dispenser, includes: a fluid dispensation pipe, for receiving a fluid and controlling a dispensation the fluid; a MEMS sensor, for sensing a movement of the fluid dispenser, wherein when the movement is determined to be in an abnormal status, the MEMS sensor generates an alarm signal; and a dispensation stopper, for stopping the dispensation of the fluid according to the alarm signal.

Abstract: The invention provides a combo MEMS device. The combo MEMS device includes a substrate, a device layer, a cap, and at least two sensor units. The device layer is on the substrate. The cap is on the device layer. At least two sensor units which are adjacent to each other are both formed by the substrate, the device layer, and the cap. The first sensor unit includes a sealed space, and the second sensor unit includes a membrane and a semi-sealed space. The membrane is formed by reducing a thickness of a portion of the device layer. The semi-sealed space is formed between the substrate and the device layer or between the device layer and the cap, to receive an external pressure through an external pressure communication opening. The external pressure communication opening is formed between the substrate and the device layer, or between the device layer and the cap, or between the substrate and the cap.

Abstract: The present invention discloses a MEMS device. The MEMS device includes a substrate, a proof mass, a frame spring and an anchor. The proof mass is connected to the substrate through the frame spring and the anchor. The proof mass includes a proof mass body, a proof mass frame surrounding the proof mass body, a linking element connecting the proof mass body to the proof mass frame, and a stopper between the proof mass body and the proof mass frame in a displacement direction to limit the displacement of the proof mass body. The stopper is connected to the proof mass frame as a part of the proof mass and contributes to the mass quantity of the proof mass.

Abstract: The invention provides a micro-electro-mechanical system device including: a substrate; a proof mass, including an outer frame which inwardly defines an internal space, and at least one inner extension portion which is directly connected to the outer frame and inwardly extends from the outer frame; at least one compliant structure, located in the internal space, and directly connected to the corresponding inner extension portion; an anchor, located in the internal space and directly connected to the at least one compliant structure, the anchor being connected to the substrate; movable electrodes, located in the internal space and connected to the proof mass; and fixed electrodes, respectively located in correspondence to the movable electrodes, and being connected to the substrate through fixing portions.

Abstract: The invention provides an MEMS device. The MEMS device includes: a substrate, a proof mass, a spring, a spring anchor, a first electrode anchor, and a second electrode anchor, a first fixed electrode and a second fixed electrode. The proof mass is connected to the substrate through the spring and the spring anchor. The proof mass includes a hollow structure inside, and the spring anchor, the first electrode anchor, and the second electrode anchor are located in the hollow structure. The proof mass and the first fixed electrode form a first capacitor, and the proof mass and the second fixed electrode form a second capacitor. There is neither any portion of the proof mass nor any portion of any fixing electrode located between the first electrode anchor, second electrode anchor, and the spring anchor.

Abstract: The present invention discloses a MEMS device. The MEMS device includes a substrate, a proof mass, a frame spring and an anchor. The proof mass is connected to the substrate through the frame spring and the anchor. The proof mass includes a proof mass body, a proof mass frame surrounding the proof mass body, a linking element connecting the proof mass body to the proof mass frame, and a stopper between the proof mass body and the proof mass frame in a displacement direction to limit the displacement of the proof mass body. The stopper is connected to the proof mass frame as a part of the proof mass and contributes to the mass quantity of the proof mass.

Abstract: The invention provides a micro-electro-mechanical system device including: a substrate; a proof mass, including an outer frame which inwardly defines an internal space, and at least one inner extension portion which is directly connected to the outer frame and inwardly extends from the outer frame; at least one compliant structure, located in the internal space, and directly connected to the corresponding inner extension portion; an anchor, located in the internal space and directly connected to the at least one compliant structure, the anchor being connected to the substrate; movable electrodes, located in the internal space and connected to the proof mass; and fixed electrodes, respectively located in correspondence to the movable electrodes, and being connected to the substrate through fixing portions.

Abstract: The invention provides an MEMS device. The MEMS device includes: a substrate, a proof mass, a spring, a spring anchor, a first electrode anchor, and a second electrode anchor, a first fixed electrode and a second fixed electrode. The proof mass is connected to the substrate through the spring and the spring anchor. The proof mass includes a hollow structure inside, and the spring anchor, the first electrode anchor, and the second electrode anchor are located in the hollow structure. The proof mass and the first fixed electrode form a first capacitor, and the proof mass and the second fixed electrode form a second capacitor. There is neither any portion of the proof mass nor any portion of any fixing electrode located between the first electrode anchor, second electrode anchor, and the spring anchor.

Abstract: The invention provides a micro-electro-mechanical system (MEMS) module, which includes a MEMS die stacked on an electronic circuit die. The electronic circuit die includes a substrate, the substrate including at least one through-silicon via (TSV) penetrating through the substrate; and at least one electronic circuit. The electronic circuit includes a circuit region, and a signal transmission layer directly connecting the TSV. At least one wire is connected between a middle part of the MEMS die and the TSV. There is no signal communication at the interfacing location where the MEMS die is stacked on and bonded with the electronic circuit die.

Abstract: A MEMS chip includes a cap layer and a composite device layer. The cap layer includes a substrate. The substrate has a first region and a second region, wherein the first region includes plural first trenches and the second region has plural second trenches. The first region has a first etch pattern density and the second region has a second etch pattern density, wherein the first etch pattern density is higher than the second etch pattern density to form chambers of different pressures.

Abstract: The present invention discloses a micro-electro-mechanical system (MEMS) device. The MEMS device includes: a substrate; a proof mass which defines an internal space inside and forms at least two capacitors with the substrate; at least two anchors connected to the substrate and respectively located in the capacitor areas of the capacitors from a cross-sectional view; at least one linkage truss located in the hollow structure, wherein the linkage truss is directly connected to the anchors or indirectly connected to the anchors through buffer springs; and multiple rotation springs located in the hollow structure, wherein the rotation springs are connected between the proof mass and the linkage truss, such that the proof mass can rotate along an axis formed by the rotation springs. There is no coupling mass which does not form a movable electrode in the connection between the proof mass and the substrate.

Abstract: The invention provides a micro-electro-mechanical system (MEMS) module, which includes a MEMS die stacked on an electronic circuit die. The electronic circuit die includes a substrate, the substrate including at least one through-silicon via (TSV) penetrating through the substrate; and at least one electronic circuit. The electronic circuit includes a circuit region, and a signal transmission layer directly connecting the TSV. At least one wire is connected between a middle part of the MEMS die and the TSV. There is no signal communication at the interfacing location where the MEMS die is stacked on and bonded with the electronic circuit die.

Abstract: A MEMS chip includes a cap layer and a composite device layer. The cap layer includes a substrate. The substrate has a first region and a second region, wherein the first region includes plural first trenches and the second region has plural second trenches. The first region has a first etch pattern density and the second region has a second etch pattern density, wherein the first etch pattern density is higher than the second etch pattern density to form chambers of different pressures.

Abstract: The invention provides a manufacturing method of a MEMS device, which includes: providing an integrated circuit device including a substrate and an electrical structure on the substrate, the electrical structure includes at least one sensing region and at least one first connection section; providing a structure layer, and forming at least one second connection section on the structure layer; bonding the at least one first connection section and the at least one second connection section; etching the structure layer for forming at least one movable structure, the movable structure being located at a position corresponding to a position of the sensing region, and the movable structure being connected to the at least one first connection section via the at least one second connection section; and thereafter, providing a cap to cover the movable structure and the sensing region, wherein the movable structure is not directly connected to the cap.

Abstract: The invention provides a manufacturing method of a MEMS device, which includes: providing an integrated circuit device including a substrate and an electrical structure on the substrate, the electrical structure includes at least one sensing region and at least one first connection section; providing a structure layer, and forming at least one second connection section on the structure layer; bonding the at least one first connection section and the at least one second connection section; etching the structure layer for forming at least one movable structure, the movable structure being located at a position corresponding to a position of the sensing region, and the movable structure being connected to the at least one first connection section via the at least one second connection section; and thereafter, providing a cap to cover the movable structure and the sensing region, wherein the movable structure is not directly connected to the cap.