Patents by Inventor Chiung-Min LIN

Chiung-Min LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for sensory automated material handing
    Patent number: 10564632
    Abstract: In an embodiment an automated material handling system (AMHS) for a semiconductor fabrication facility (FAB) includes: a sensor supported by a rail, wherein the sensor is configured to collect sensor data characterizing a vehicle that moves along the rail, wherein the vehicle is configured to carry at least one wafer; and a monitoring module configured to: detect a trigger event based on the sensor data, and initiate a remediation action in response to the trigger event.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: February 18, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yung-Lin Hsu, Richard Lin, Chiung-Min Lin, Alan Yang
  • SYSTEMS AND METHODS FOR SENSORY AUTOMATED MATERIAL HANDING
    Publication number: 20190163170
    Abstract: In an embodiment an automated material handling system (AMHS) for a semiconductor fabrication facility (FAB) includes: a sensor supported by a rail, wherein the sensor is configured to collect sensor data characterizing a vehicle that moves along the rail, wherein the vehicle is configured to carry at least one wafer; and a monitoring module configured to: detect a trigger event based on the sensor data, and initiate a remediation action in response to the trigger event.
    Type: Application
    Filed: January 30, 2018
    Publication date: May 30, 2019
    Inventors: Yung-Lin HSU, Richard LIN, Chiung-Min LIN, Alan YANG
  • Dual-function wafer handling apparatus
    Patent number: 10018573
    Abstract: A dual-function wafer handling apparatus for handling a wafer includes an aligner for rotating the wafer, an ID reader disposed corresponding to an edge of the wafer for reading an ID of the wafer, and an optical defect inspection unit for capturing images to analysis.
    Type: Grant
    Filed: October 13, 2014
    Date of Patent: July 10, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Han Tsai, Sheng-Hsiang Chuang, Guan-Cyun Li, Yen-Ju Wei, Chiung-Min Lin, Yi-Ming Chen
  • DUAL-FUNCTION WAFER HANDLING APPARATUS
    Publication number: 20160103080
    Abstract: A dual-function wafer handling apparatus for handling a wafer includes an aligner for rotating the wafer, an ID reader disposed corresponding to an edge of the wafer for reading an ID of the wafer, and an optical defect inspection unit for capturing images to analysis.
    Type: Application
    Filed: October 13, 2014
    Publication date: April 14, 2016
    Inventors: Ming-Han TSAI, Sheng-Hsiang CHUANG, Guan-Cyun LI, Yen-Ju WEI, Chiung-Min LIN, Yi-Ming CHEN