Patents by Inventor Chiyomi Uchiyama

Chiyomi Uchiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light-emitting element assembly and method for manufacturing the same
    Patent number: 8372670
    Abstract: A method for making a light-emitting element assembly including a support substrate having a first surface, a second surface facing the first surface, a recessed portion, and a conductive material layer formed over the first surface and the inner surface of the recessed portion, and a light-emitting element. The light-emitting element has a laminated structure including a first compound semiconductor layer, a light-emitting portion, and a second compound semiconductor layer, at least the second compound semiconductor layer and the light-emitting portion constituting a mesa structure. The light-emitting element further includes an insulating layer formed, a second electrode, and a first electrode. The mesa structure is placed in the recessed portion so that the conductive material layer and the second electrode are in at least partial contact with each other, and light emitted from the light-emitting portion is emitted from the second surface side of the first compound semiconductor layer.
    Type: Grant
    Filed: July 22, 2010
    Date of Patent: February 12, 2013
    Assignee: Sony Corporation
    Inventors: Rintaro Koda, Takahiro Arakida, Satoshi Taniguchi, Yuji Masui, Nobuhiro Suzuki, Tomoyuki Oki, Chiyomi Uchiyama, Kayoko Kikuchi
  • LIGHT-EMITTING ELEMENT ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20100285625
    Abstract: A method for making a light-emitting element assembly including a support substrate having a first surface, a second surface facing the first surface, a recessed portion, and a conductive material layer formed over the first surface and the inner surface of the recessed portion, and a light-emitting element. The light-emitting element has a laminated structure including a first compound semiconductor layer, a light-emitting portion, and a second compound semiconductor layer, at least the second compound semiconductor layer and the light-emitting portion constituting a mesa structure. The light-emitting element further includes an insulating layer formed, a second electrode, and a first electrode. The mesa structure is placed in the recessed portion so that the conductive material layer and the second electrode are in at least partial contact with each other, and light emitted from the light-emitting portion is emitted from the second surface side of the first compound semiconductor layer.
    Type: Application
    Filed: July 22, 2010
    Publication date: November 11, 2010
    Applicant: SONY CORPORATION
    Inventors: Rintaro Koda, Takahiro Arakida, Satoshi Taniguchi, Yuji Masui, Nobuhiro Suzuki, Tomoyuki Oki, Chiyomi Uchiyama, Kayoko Kikuchi
  • Light-emitting element assembly and method for manufacturing the same
    Patent number: 7787512
    Abstract: A light-emitting element assembly includes a support substrate having a first surface, a second surface facing the first surface, a recessed portion, and a conductive material layer formed over the first surface and the inner surface of the recessed portion, and a light-emitting element. The light-emitting element has a laminated structure including a first compound semiconductor layer, a light-emitting portion, and a second compound semiconductor layer, at least the second compound semiconductor layer and the light-emitting portion constituting a mesa structure. The light-emitting element further includes an insulating layer formed, a second electrode, and a first electrode. The mesa structure is placed in the recessed portion so that the conductive material layer and the second electrode are in at least partial contact with each other, and light emitted from the light-emitting portion is emitted from the second surface side of the first compound semiconductor layer.
    Type: Grant
    Filed: December 12, 2008
    Date of Patent: August 31, 2010
    Assignee: Sony Corporation
    Inventors: Rintaro Koda, Takahiro Arakida, Satoshi Taniguchi, Yuji Masui, Nobuhiro Suzuki, Tomoyuki Oki, Chiyomi Uchiyama, Kayoko Kikuchi
  • LIGHT-EMITTING ELEMENT ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20090168825
    Abstract: A light-emitting element assembly includes a support substrate having a first surface, a second surface facing the first surface, a recessed portion, and a conductive material layer formed over the first surface and the inner surface of the recessed portion, and a light-emitting element. The light-emitting element has a laminated structure including a first compound semiconductor layer, a light-emitting portion, and a second compound semiconductor layer, at least the second compound semiconductor layer and the light-emitting portion constituting a mesa structure. The light-emitting element further includes an insulating layer formed, a second electrode, and a first electrode. The mesa structure is placed in the recessed portion so that the conductive material layer and the second electrode are in at least partial contact with each other, and light emitted from the light-emitting portion is emitted from the second surface side of the first compound semiconductor layer.
    Type: Application
    Filed: December 12, 2008
    Publication date: July 2, 2009
    Applicant: Sony Corporation
    Inventors: Rintaro Koda, Takahiro Arakida, Satoshi Taniguchi, Yuji Masui, Nobuhiro Suzuki, Tomoyuki Oki, Chiyomi Uchiyama, Kayoko Kikuchi