Abstract: A heat radiating device includes a plurality of heat pipes including respective heat receiving portions that are located above an integrated circuit and that are thermally connected to the integrated circuit, and a heat sink connected to the plurality of heat pipes. A plurality of the heat receiving portions are aligned with each other in a left-right direction and are in contact with the heat receiving portions (73a) of adjacent ones of the heat pipes. The heat receiving portions each have a first width in an upward-downward direction and have a second width smaller than the width in the left-right direction. With this, cooling performance for the integrated circuit can be improved.

Abstract: A base block has a longitudinal direction and a width direction and includes a recessed part in which a heat receiving tubular portion is accommodated, and a container part of a heat pipe is caulked and fixed in a recessed part and a first metal part containing first metal having a melting point equal to or higher than 130° C. and equal to or lower than 400° C. and/or a first metal alloy having a melting point equal to or higher than 130° C. and equal to or lower than 400° C. is formed between the recessed part and an outer surface of the container part.

Abstract: A heat pipe structure includes a base block including a rear surface part thermally connectable to a heat generating body and a heat pipe fixed to a front surface part of the base block and including a heat receiving tubular portion disposed along an in-plane direction of the base block. The base block has a longitudinal direction and a width direction and includes a recessed part in which the heat receiving tubular portion is housed and a pair of wall parts projecting along an outer circumferential surface of the heat receiving tubular portion from width direction both sides of the recessed part, and a container of the heat pipe is caulked and fixed by the recessed part and the pair of wall parts and includes a projecting shape part projecting in a direction opposite to a direction of the caulking between distal end portions of the pair of wall parts.

Abstract: At least one heat pipe is fixed to each of fin plates, a rectangular fin plate assembly is constituted of the fin plate, the fin plate and the fin plate of the plurality of respective radiation fin parts as the plurality of radiation fin parts are seen from the direction in which the heat pipes extend, the plurality of heat pipes include a first heat pipe group and a second heat pipe group, the first heat pipe group is positioned at the center in the longitudinal direction of the fin plate assembly, the second heat pipe group is positioned on both sides of the first heat pipe group in the longitudinal direction of the fin plate assembly, and the fin plate thermally connected to the first heat pipe group includes expanding parts.

Abstract: A heat receiving structure and a heat sink that can ensure a sufficient contact area between a heat pipe and a heat receiving member, and are high in strength. The heat receiving structure includes heat receiving blocks that have concave inner faces along an external shape of a heat pipe, in which extended portions at both sides that continue to the inner faces extend inward in a radial direction of the heat pipe while covering the heat pipe, and the heat pipe is sandwiched by the heat receiving blocks from both sides and joined.

Abstract: A heat sink with a centrifugal fan comprising: a cover of a prescribed shape including an air intake port and an air discharge port; a heat receiving block thermally connected to a heat generating part to be cooled; a bottom portion which is excellent in heat transferability, thermally connected to one face of said heat receiving block, and engaged to said cover to form a space portion; a heat dissipating fin portion comprising a plurality of fins, received within the space portion, thermally connected to said bottom portion, and having a prescribed shape including at least an air inflow portion; and a centrifugal fan, a rotating shaft of which is arranged in a vicinity of the air inflow portion of said heat dissipating fin portion, which intakes air from the air intake port, generates an air flow through spaces formed between adjacent fins of said heat dissipating fin portion, and generates another air flow along an inner wall of said cover toward said air discharge port.

Abstract: The present invention is to provide a heat sink withheat pipe, which is limited in height, not so noisy, compact and highly efficient in radiation, and can lower the temperature inside a casing as a whole more effectively even when it is used in an electronic appliance limited in height such as a personal computer, a game machine or the like.

Abstract: A heat sink comprising: a heat dissipating portion comprising a plurality of metal fins each having a heat receiving portion and a heat dissipating portion having elasticity; a fin fixing member to transfix said plurality of metal fins; a metal plate having a plurality of slits into which said respective heat dissipating portions are inserted and press-connected thereto with use of said elasticity; and a joining portion to join said metal plate and said heat dissipating portions which are inserted into said respective slits and fixed thereto.

Abstract: A heat sink with a centrifugal fan comprising: a cover of a prescribed shape including an air intake port and an air discharge port; a heat receiving block thermally connected to a heat generating part to be cooled; a bottom portion which is excellent in heat transferability, thermally connected to one face of said heat receiving block, and engaged to said cover to form a space portion; a heat dissipating fin portion comprising a plurality of fins, received within the space portion, thermally connected to said bottom portion, and having a prescribed shape including at least an air inflow portion; and a centrifugal fan, a rotating shaft of which is arranged in a vicinity of the air inflow portion of said heat dissipating fin portion, which intakes air from the air intake port, generates an air flow through spaces formed between adjacent fins of said heat dissipating fin portion, and generates another air flow along an inner wall of said cover toward said air discharge port.

Abstract: Provided is a structure in which a shield 308 and a heat sink 307 integrated with a radiation fin 306 are sandwiched by a main substrate 381a and a power source substrate 381b. A hood 142d covers the radiation fin 306 so as to collect air for cooling. Major parts of the main substrate 381a are in contact with the heat sink 307 via heat conduction members having different heat conductivity so that an even thermal distribution is provided. Thus, parts of electronic equipment can be efficiently disposed in a limited space. Moreover, the parts of the electronic equipment can be effectively cooled.

Abstract: A heat sink comprising: a heat dissipating portion comprising a plurality of metal fins each having a heat receiving portion and a heat dissipating portion having elasticity; a fin fixing member to transfix said plurality of metal fins; a metal plate having a plurality of slits into which said respective heat dissipating portions are inserted and press-connected thereto with use of said elasticity; and a joining portion to join said metal plate and said heat dissipating portions which are inserted into said respective slits and fixed thereto.

Abstract: A heat sink including a heat dissipating fin comprises (1) a heat dissipating fin having a plurality of mountain-shaped portions and base portions supporting the mountain-shaped portions, (2) a base member having a plurality of slits into which the mountain-shaped portions of the heat dissipating fin are to be inserted and a plurality of holes for fixing the heat dissipating fin, and (3) a fitting member, provided with a plurality of projecting portions corresponding to the plurality of holes of the base member, for fixing the heat dissipating fin between the base member and the fitting member itself.

Abstract: A method for cooling a box with heat generating element received therein, comprising the steps of: (1) arranging in the box an air intake port for taking in air from outside and a discharge port for discharging air from the box to the outside, and installing a heat dissipating fin in the box, (2) disposing a part or a whole of the heat dissipating fin close to the air intake port within the box, and (3) causing the air taken in from the air intake port to pass through the heat dissipating fin to dissipate heat generated by the heat generating element, and then discharging air with a temperature raised by passing through the heat dissipating fin from the discharge port to outside of the box, thus cooling the box.

Abstract: A device and method for manufacturing a heat sink that has a base and heat radiating fins of various shapes and has a prescribed strength, high heat-radiating efficiency, and whose base and heat-radiating fins are formed integrally. The heat sink manufacturing device includes a die casting machine which has the cavity for a base and heat-radiating fins, and which includes a fixed mold, a movable mold that can move in the vertical or up-down direction, and a slide mold that can move in the horizontal direction.

Abstract: A heat pipe hinge structure for an electronic device comprises a heat pipe hinge member and a hinge portion. The heat pipe hinge member is made of a high heat-conductive material disposed at a coupling portion in which a pair of housing portions to be opened and closed are coupled. The heat pipe hinge member comprises a heat pipe hinge main body to receive a heat from a heat generating component disposed in one of the pair of housing portions, and a heat pipe holding portion provided in a vicinity of the heat pipe hinge main body to pivotably hold by an elastic member at least a part of a first heat pipe disposed in other of the pair of housing portion. The hinge portion is made of a low heat-conductive material to fix the heat pipe hinge member on at least one housing portion of the pair of housing portions.

Abstract: Provided is a structure in which a shield 308 and a heat sink 307 integrated with a radiation fin 306 are sandwiched by a main substrate 381a and a power source substrate 381b. A hood 142d covers the radiation fin 306 so as to collect air for cooling. Major parts of the main substrate 381a are in contact with the heat sink 307 via heat conduction members having different heat conductivity so that an even thermal distribution is provided. Thus, parts of electronic equipment can be efficiently disposed in a limited space. Moreover, the parts of the electronic equipment can be effectively cooled.

Abstract: A heat sink including a heat dissipating fin comprises (1) a heat dissipating fin having a plurality of mountain-shaped portions and base portions supporting the mountain-shaped portions, (2) a base member having a plurality of slits into which the mountain-shaped portions of the heat dissipating fin are to be inserted and a plurality of holes for fixing the heat dissipating fin, and (3) a fitting member, provided with a plurality of projecting portions corresponding to the plurality of holes of the base member, for fixing the heat dissipating fin between the base member and the fitting member itself.

Abstract: A heat pipe hinge structure for an electronic device comprises a heat pipe hinge member and a hinge portion. The heat pipe hinge member is made of a high heat-conductive material disposed at a coupling portion in which a pair of housing portions to be opened and closed are coupled. The heat pipe hinge member comprises a heat pipe hinge main body to receive a heat from a heat generating component disposed in one of the pair of housing portions, and a heat pipe holding portion provided in a vicinity of the heat pipe hinge main body to pivotably hold by an elastic member at least a part of a first heat pipe disposed in other of the pair of housing portions. The hinge portion is made of a low heat-conductive material to fox the heat pipe hinge member on at least one housing portion of the pair of housing portions.

Abstract: It is an object of the present invention to provide a device and method for manufacturing a heat sink that has a base and heat radiating fins of various shapes and has prescribed strength, high heat-radiating efficiency, and whose base and heat-radiating fins are formed integrally.

Abstract: A heat pipe hinge structure for an electronic device comprises a heat pipe hinge member and a hinge portion. The heat pipe hinge member is made of a high heat-conductive material disposed at a coupling portion in which a pair of housing portions to be opened and closed are coupled. The heat pipe hinge member comprises a heat pipe hinge main body to receive a heat from a heat generating component disposed in one of the pair of housing portions, and a heat pipe holding portion provided in a vicinity of the heat pipe hinge main body to pivotably hold by an elastic member at least a part of a first heat pipe disposed in other of the pair of housing portions. The hinge portion is made of a low heat-conductive material to fix the heat pipe hinge member on at least one housing portion of the pair of housing portions.