Patents by Inventor Chiyoshi Sasaki

Chiyoshi Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210318075
    Abstract: A base block has a longitudinal direction and a width direction and includes a recessed part in which a heat receiving tubular portion is accommodated, and a container part of a heat pipe is caulked and fixed in a recessed part and a first metal part containing first metal having a melting point equal to or higher than 130° C. and equal to or lower than 400° C. and/or a first metal alloy having a melting point equal to or higher than 130° C. and equal to or lower than 400° C. is formed between the recessed part and an outer surface of the container part.
    Type: Application
    Filed: June 24, 2021
    Publication date: October 14, 2021
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Chiyoshi SASAKI, Masakazu ISEMURA
  • Publication number: 20210129206
    Abstract: A heat pipe structure includes a base block including a rear surface part thermally connectable to a heat generating body and a heat pipe fixed to a front surface part of the base block and including a heat receiving tubular portion disposed along an in-plane direction of the base block. The base block has a longitudinal direction and a width direction and includes a recessed part in which the heat receiving tubular portion is housed and a pair of wall parts projecting along an outer circumferential surface of the heat receiving tubular portion from width direction both sides of the recessed part, and a container of the heat pipe is caulked and fixed by the recessed part and the pair of wall parts and includes a projecting shape part projecting in a direction opposite to a direction of the caulking between distal end portions of the pair of wall parts.
    Type: Application
    Filed: December 22, 2020
    Publication date: May 6, 2021
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Chiyoshi SASAKI, Masakazu ISEMURA, Takahiro KATAYAMA
  • Publication number: 20170307304
    Abstract: At least one heat pipe is fixed to each of fin plates, a rectangular fin plate assembly is constituted of the fin plate, the fin plate and the fin plate of the plurality of respective radiation fin parts as the plurality of radiation fin parts are seen from the direction in which the heat pipes extend, the plurality of heat pipes include a first heat pipe group and a second heat pipe group, the first heat pipe group is positioned at the center in the longitudinal direction of the fin plate assembly, the second heat pipe group is positioned on both sides of the first heat pipe group in the longitudinal direction of the fin plate assembly, and the fin plate thermally connected to the first heat pipe group includes expanding parts.
    Type: Application
    Filed: November 10, 2014
    Publication date: October 26, 2017
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Takeshi HIRASAWA, Chiyoshi SASAKI, Masami IKEDA
  • Publication number: 20160282054
    Abstract: A heat receiving structure and a heat sink that can ensure a sufficient contact area between a heat pipe and a heat receiving member, and are high in strength. The heat receiving structure includes heat receiving blocks that have concave inner faces along an external shape of a heat pipe, in which extended portions at both sides that continue to the inner faces extend inward in a radial direction of the heat pipe while covering the heat pipe, and the heat pipe is sandwiched by the heat receiving blocks from both sides and joined.
    Type: Application
    Filed: December 22, 2014
    Publication date: September 29, 2016
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Takeshi HIRASAWA, Chiyoshi SASAKI, Masami IKEDA
  • Patent number: 8011423
    Abstract: A heat sink with a centrifugal fan comprising: a cover of a prescribed shape including an air intake port and an air discharge port; a heat receiving block thermally connected to a heat generating part to be cooled; a bottom portion which is excellent in heat transferability, thermally connected to one face of said heat receiving block, and engaged to said cover to form a space portion; a heat dissipating fin portion comprising a plurality of fins, received within the space portion, thermally connected to said bottom portion, and having a prescribed shape including at least an air inflow portion; and a centrifugal fan, a rotating shaft of which is arranged in a vicinity of the air inflow portion of said heat dissipating fin portion, which intakes air from the air intake port, generates an air flow through spaces formed between adjacent fins of said heat dissipating fin portion, and generates another air flow along an inner wall of said cover toward said air discharge port.
    Type: Grant
    Filed: October 2, 2006
    Date of Patent: September 6, 2011
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Yasuhiro Uchimura, Chiyoshi Sasaki, Nobuyuki Hashimoto
  • Publication number: 20090321058
    Abstract: The present invention is to provide a heat sink withheat pipe, which is limited in height, not so noisy, compact and highly efficient in radiation, and can lower the temperature inside a casing as a whole more effectively even when it is used in an electronic appliance limited in height such as a personal computer, a game machine or the like.
    Type: Application
    Filed: September 21, 2006
    Publication date: December 31, 2009
    Applicant: Sony Computer Enterainment Inc.
    Inventors: Yasuhiro Uchimura, Chiyoshi Sasaki, Nobuyuki Hashimoto
  • Patent number: 7613004
    Abstract: A heat sink comprising: a heat dissipating portion comprising a plurality of metal fins each having a heat receiving portion and a heat dissipating portion having elasticity; a fin fixing member to transfix said plurality of metal fins; a metal plate having a plurality of slits into which said respective heat dissipating portions are inserted and press-connected thereto with use of said elasticity; and a joining portion to join said metal plate and said heat dissipating portions which are inserted into said respective slits and fixed thereto.
    Type: Grant
    Filed: March 17, 2004
    Date of Patent: November 3, 2009
    Assignee: The Furukawa Electric Co., Ltd.
    Inventor: Chiyoshi Sasaki
  • Publication number: 20070204976
    Abstract: A heat sink with a centrifugal fan comprising: a cover of a prescribed shape including an air intake port and an air discharge port; a heat receiving block thermally connected to a heat generating part to be cooled; a bottom portion which is excellent in heat transferability, thermally connected to one face of said heat receiving block, and engaged to said cover to form a space portion; a heat dissipating fin portion comprising a plurality of fins, received within the space portion, thermally connected to said bottom portion, and having a prescribed shape including at least an air inflow portion; and a centrifugal fan, a rotating shaft of which is arranged in a vicinity of the air inflow portion of said heat dissipating fin portion, which intakes air from the air intake port, generates an air flow through spaces formed between adjacent fins of said heat dissipating fin portion, and generates another air flow along an inner wall of said cover toward said air discharge port.
    Type: Application
    Filed: October 2, 2006
    Publication date: September 6, 2007
    Applicant: The Furukawa Electric Co. Ltd.
    Inventors: Yasuhiro Uchimura, Chiyoshi Sasaki, Nobuyuki Hashimoto
  • Patent number: 7254035
    Abstract: Provided is a structure in which a shield 308 and a heat sink 307 integrated with a radiation fin 306 are sandwiched by a main substrate 381a and a power source substrate 381b. A hood 142d covers the radiation fin 306 so as to collect air for cooling. Major parts of the main substrate 381a are in contact with the heat sink 307 via heat conduction members having different heat conductivity so that an even thermal distribution is provided. Thus, parts of electronic equipment can be efficiently disposed in a limited space. Moreover, the parts of the electronic equipment can be effectively cooled.
    Type: Grant
    Filed: October 24, 2001
    Date of Patent: August 7, 2007
    Assignee: Sony Computer Entertainment Inc.
    Inventors: Chiyoshi Sasaki, Kouji Hirata, Katsushi Itoh, Yasuhiro Ootori, Ryouichi Kubota
  • Publication number: 20040190260
    Abstract: A heat sink comprising: a heat dissipating portion comprising a plurality of metal fins each having a heat receiving portion and a heat dissipating portion having elasticity; a fin fixing member to transfix said plurality of metal fins; a metal plate having a plurality of slits into which said respective heat dissipating portions are inserted and press-connected thereto with use of said elasticity; and a joining portion to join said metal plate and said heat dissipating portions which are inserted into said respective slits and fixed thereto.
    Type: Application
    Filed: March 17, 2004
    Publication date: September 30, 2004
    Inventor: Chiyoshi Sasaki
  • Patent number: 6742573
    Abstract: A heat sink including a heat dissipating fin comprises (1) a heat dissipating fin having a plurality of mountain-shaped portions and base portions supporting the mountain-shaped portions, (2) a base member having a plurality of slits into which the mountain-shaped portions of the heat dissipating fin are to be inserted and a plurality of holes for fixing the heat dissipating fin, and (3) a fitting member, provided with a plurality of projecting portions corresponding to the plurality of holes of the base member, for fixing the heat dissipating fin between the base member and the fitting member itself.
    Type: Grant
    Filed: December 4, 2001
    Date of Patent: June 1, 2004
    Assignees: The Furukawa Electric Co., Ltd., Sony Computer Entertainment, Inc.
    Inventors: Chiyoshi Sasaki, Junji Sotani, Masaru Ohmi, Toshikatsu Hama, Yasuhiro Ootori
  • Patent number: 6637505
    Abstract: A method for cooling a box with heat generating element received therein, comprising the steps of: (1) arranging in the box an air intake port for taking in air from outside and a discharge port for discharging air from the box to the outside, and installing a heat dissipating fin in the box, (2) disposing a part or a whole of the heat dissipating fin close to the air intake port within the box, and (3) causing the air taken in from the air intake port to pass through the heat dissipating fin to dissipate heat generated by the heat generating element, and then discharging air with a temperature raised by passing through the heat dissipating fin from the discharge port to outside of the box, thus cooling the box.
    Type: Grant
    Filed: August 18, 2000
    Date of Patent: October 28, 2003
    Assignees: The Furukawa Electric Co., Ltd., Sony Computer Entertainment, Inc.
    Inventor: Chiyoshi Sasaki
  • Patent number: 6516867
    Abstract: A device and method for manufacturing a heat sink that has a base and heat radiating fins of various shapes and has a prescribed strength, high heat-radiating efficiency, and whose base and heat-radiating fins are formed integrally. The heat sink manufacturing device includes a die casting machine which has the cavity for a base and heat-radiating fins, and which includes a fixed mold, a movable mold that can move in the vertical or up-down direction, and a slide mold that can move in the horizontal direction.
    Type: Grant
    Filed: September 7, 2000
    Date of Patent: February 11, 2003
    Assignee: Sony Computer Entertainment Inc.
    Inventors: Yasuhiro Ootori, Chiyoshi Sasaki
  • Patent number: 6507490
    Abstract: A heat pipe hinge structure for an electronic device comprises a heat pipe hinge member and a hinge portion. The heat pipe hinge member is made of a high heat-conductive material disposed at a coupling portion in which a pair of housing portions to be opened and closed are coupled. The heat pipe hinge member comprises a heat pipe hinge main body to receive a heat from a heat generating component disposed in one of the pair of housing portions, and a heat pipe holding portion provided in a vicinity of the heat pipe hinge main body to pivotably hold by an elastic member at least a part of a first heat pipe disposed in other of the pair of housing portion. The hinge portion is made of a low heat-conductive material to fix the heat pipe hinge member on at least one housing portion of the pair of housing portions.
    Type: Grant
    Filed: January 28, 2002
    Date of Patent: January 14, 2003
    Assignee: The Furakawa Electric Co., Ltd.
    Inventors: Chiyoshi Sasaki, Hiroaki Maekawa, Junji Sotani, Masaru Ohmi, Isao Tsukada, Toru Arimoto
  • Publication number: 20020089825
    Abstract: Provided is a structure in which a shield 308 and a heat sink 307 integrated with a radiation fin 306 are sandwiched by a main substrate 381a and a power source substrate 381b. A hood 142d covers the radiation fin 306 so as to collect air for cooling. Major parts of the main substrate 381a are in contact with the heat sink 307 via heat conduction members having different heat conductivity so that an even thermal distribution is provided. Thus, parts of electronic equipment can be efficiently disposed in a limited space. Moreover, the parts of the electronic equipment can be effectively cooled.
    Type: Application
    Filed: October 24, 2001
    Publication date: July 11, 2002
    Inventors: Chiyoshi Sasaki, Kouji Hirata, Katsushi Itoh, Yasuhiro Ootori, Ryouichi Kubota
  • Publication number: 20020084060
    Abstract: A heat sink including a heat dissipating fin comprises (1) a heat dissipating fin having a plurality of mountain-shaped portions and base portions supporting the mountain-shaped portions, (2) a base member having a plurality of slits into which the mountain-shaped portions of the heat dissipating fin are to be inserted and a plurality of holes for fixing the heat dissipating fin, and (3) a fitting member, provided with a plurality of projecting portions corresponding to the plurality of holes of the base member, for fixing the heat dissipating fin between the base member and the fitting member itself.
    Type: Application
    Filed: December 4, 2001
    Publication date: July 4, 2002
    Inventors: Chiyoshi Sasaki, Junji Sotani, Masaru Ohmi, Toshikatsu Hama, Yasuhiro Ootori
  • Publication number: 20020064027
    Abstract: A heat pipe hinge structure for an electronic device comprises a heat pipe hinge member and a hinge portion. The heat pipe hinge member is made of a high heat-conductive material disposed at a coupling portion in which a pair of housing portions to be opened and closed are coupled. The heat pipe hinge member comprises a heat pipe hinge main body to receive a heat from a heat generating component disposed in one of the pair of housing portions, and a heat pipe holding portion provided in a vicinity of the heat pipe hinge main body to pivotably hold by an elastic member at least a part of a first heat pipe disposed in other of the pair of housing portions. The hinge portion is made of a low heat-conductive material to fox the heat pipe hinge member on at least one housing portion of the pair of housing portions.
    Type: Application
    Filed: January 28, 2002
    Publication date: May 30, 2002
    Inventors: Chiyoshi Sasaki, Hiroaki Maekawa, Junji Sotani, Masaru Ohmi, Isao Tsukada, Toru Arimoto
  • Publication number: 20020050333
    Abstract: It is an object of the present invention to provide a device and method for manufacturing a heat sink that has a base and heat radiating fins of various shapes and has prescribed strength, high heat-radiating efficiency, and whose base and heat-radiating fins are formed integrally.
    Type: Application
    Filed: December 5, 2001
    Publication date: May 2, 2002
    Inventors: Yasuhiro Ootori, Chiyoshi Sasaki
  • Patent number: 6377454
    Abstract: A heat conducting apparatus includes a heat pipe and a heat pipe supporting mechanism. The heat pipe conducts heat between a first member and a second member connected by hinge sections. The heat pipe has a first end portion attached to one of the first and second members and a second end portion extending substantially along a center line of the hinge sections. A heat pipe supporting mechanism is disposed on a member different from the one of the first and the second members of the heat pipe. The heat pipe supporting mechanism supports the second end portion so that the second end portion can freely move within a given range. The heat pipe supporting mechanism forms a thermal path between the first and second members together with the heat pipe.
    Type: Grant
    Filed: April 26, 2000
    Date of Patent: April 23, 2002
    Assignees: Fujitsu Limited, Furukawa Electric Co., Ltd.
    Inventors: Koichi Inoue, Chiyoshi Sasaki
  • Patent number: 6377452
    Abstract: A heat pipe hinge structure for an electronic device comprises a heat pipe hinge member and a hinge portion. The heat pipe hinge member is made of a high heat-conductive material disposed at a coupling portion in which a pair of housing portions to be opened and closed are coupled. The heat pipe hinge member comprises a heat pipe hinge main body to receive a heat from a heat generating component disposed in one of the pair of housing portions, and a heat pipe holding portion provided in a vicinity of the heat pipe hinge main body to pivotably hold by an elastic member at least a part of a first heat pipe disposed in other of the pair of housing portions. The hinge portion is made of a low heat-conductive material to fix the heat pipe hinge member on at least one housing portion of the pair of housing portions.
    Type: Grant
    Filed: December 17, 1999
    Date of Patent: April 23, 2002
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Chiyoshi Sasaki, Hiroaki Maekawa, Junji Sotani, Masaru Ohmi, Isao Tsukada, Toru Arimoto