Abstract: A method of manufacturing a heat dissipation sheet comprises arranging a pair of PI-films to be spaced apart in a horizontal direction, forming a pair of PI-film laminates by laminating PI-films, respectively, drying the PI-film, disposing a first release film having a metal thin film formed on a predetermined region on the upper surface of the PI film, attaching a second release film having a double-sided tape formed thereon to a lower surface of one of the PI-film, firstly rolling an upper surface of the first release film and a lower surface of the second release film by rolling rollers, removing the first release film and the second release film from the PI-film, respectively, folding the PI-film laminates based on points spaced apart, and manufacturing a heat dissipation sheet made of a multi-layered PI-film by performing secondary rolling on surfaces of the folded PI-film laminate with the rolling rollers.

Abstract: An heat dissipation sheet with excellent thermal conductivity, which is capable of reducing manufacturing cost, is disclosed. The heat dissipation sheet of the present invention comprises a graphite layer, a first graphene layer and a second graphene layer. The first graphene layer is attached to a first surface of the graphite layer through a first adhesive layer. The second graphene layer is attached to a second surface of the graphite layer through a second adhesive layer.

Abstract: A method of manufacturing a functional sheet according to an embodiment of the present invention, comprise powdering a filler with specific functional component and a binder, charging the filler and the binder with second polarity, spraying the binder and the filler onto an upper surface of an electrode plate charged with first polarity opposite to the second polarity, heat-treating the binder and filler, pressing an upper surface of the filler with a rolling roller, and separating the binder and the filler from the electrode plate. Therefore, the method can improve functionality while reducing harmfulness by manufacturing the functional sheet using a powdered filler and binder without using an organic solvent.

Abstract: Proposed is an air purifying filter. The air purifying filter includes a filtering layer (30) configured as a dielectric which collects minute particles, a first electrode layer (50) laminated on a side of the filtering layer (30) and comprising insulated wires (51) to which power is able to be applied, and a second electrode layer (70) laminated on a side of the filtering layer (30) opposite to the side of the first electrode layer and comprising a conductive material such that a polarity opposite to a polarity of the first electrode layer (50) is applied to the second electrode layer or the second electrode layer is grounded.

Abstract: A method of manufacturing a functional sheet according to an embodiment of the present invention, comprise powdering a filler with specific functional component and a binder, charging the filler and the binder with second polarity, spraying the binder and the filler onto an upper surface of an electrode plate charged with first polarity opposite to the second polarity, heat-treating the binder and filler, pressing an upper surface of the filler with a rolling roller, and separating the binder and the filler from the electrode plate. Therefore, the method can improve functionality while reducing harmfulness by manufacturing the functional sheet using a powdered filler and binder without using an organic solvent.

Abstract: The curved-type rigid board includes: a main sheet layer capable of maintaining a curved state with a certain curvature; a first adhesive layer formed on the main sheet layer; a sub sheet layer bonded onto the main sheet layer by the first adhesive layer while the sub sheet layer forms a line structure having diagonal lines, which do not match directions of horizontal and vertical lines of the mesh structure of the thermosetting resin of which the main sheet layer is made, in order for the main sheet layer to have rigidity to maintain the curved state; a second adhesive layer formed on the sub sheet layer; and a pattern forming layer bonded onto the sub sheet layer by the second adhesive layer.

Abstract: Provided is a curved-type rigid board. The curved-type rigid board includes: a main sheet layer capable of maintaining a curved state with a certain curvature; a first adhesive layer formed on the main sheet layer; and a pattern forming layer bonded onto the main sheet layer by the first adhesive layer.

Abstract: A stand for an image display device includes a supporting member that can support an image display device, a rear base is rotatably connected to the supporting member, and a front base that is connected to the rear base. The front base is rotatable with respect to the rear base in the same direction as the rear base is rotatable with respect to the supporting member such that the front base is foldable to a rear side of the image display device.

Abstract: A stand for a display is provided. The stand can reduce a delivery volume of the display and can provide for adjustment of a rotation angle thereof during use. The stand may include a support connected to a lower portion of the display, a pivot block pivotably coupled to the support, a rear base connected to the pivot block, a swivel that pivotably couples the pivot block and the rear base, and a front base coupled to the rear base.

Abstract: The image senor includes a plurality of row lines and a plurality of column lines crossing the plurality of row lines. A pixel is formed at respective crossings of the row and column lines. Each pixel generates a charge based on light incident thereon and selectively transfers the charge to an associated column line based on a signal received from an associated row line. Each column line has a column driver circuit associated therewith. The column driver circuit is configured to generate an output voltage based on the charge on the associated column line.

Abstract: A semiconductor device includes a semiconductor chip comprising a semiconductor substrate including microelectronic devices, first interconnection lines disposed on the semiconductor substrate and electrically connected to the microelectronic devices, pads connected to the first interconnection lines, wherein the pads are disposed on an edge of the semiconductor chip, and an interconnection substrate disposed on the semiconductor substrate, wherein the interconnection substrate includes second interconnection lines connected to a part of the pads, wherein a maximum distance between the pads is less than half a length of one side of the semiconductor chip, and heights of the pads are substantially the same.

Abstract: Provided is a stand for a display device, which can reduce volume in the delivery of the display device and can adjust the rotation angle thereof. The stand includes: a display device; a support connected to a lower portion of the display device; a pivot block connected to be operable with respect to the support; a rear base connected to the pivot block; a swivel disposed in a contact portion between the pivot block and the rear base such that the pivot block is pivotally rotated; and a front base connected to be operable with respect to the rear base.

Abstract: An image sensor includes a plurality of pixels each coupled to a respective analog-to-digital converter via a respective line. The image sensor also includes a first pad and a second pad. The first pad is coupled an external tester that applies a bias voltage on the respective line via the first pad. The second pad outputs the respective code corresponding to the bias voltage from the respective analog-to-digital converter to the external tester.

Abstract: A focus control apparatus for a display is provided. The focus control apparatus adjusts the focus of a lens through a simple manipulation of an adjusting knob which adjusts a position of a connection tube connecting an image engine and a lens of the apparatus. The focus control apparatus adjusts the focus of the lens by the backward and forward movement of the connection tube, thereby simplifying the structure of the apparatus, improving productivity, and reducing the production cost.

Abstract: The image senor includes a plurality of row lines and a plurality of column lines crossing the plurality of row lines. A pixel is formed at respective crossings of the row and column lines. Each pixel generates a charge based on light incident thereon and selectively transfers the charge to an associated column line based on a signal received from an associated row line. Each column line has a column driver circuit associated therewith. The column driver circuit is configured to generate an output voltage based on the charge on the associated column line.

Abstract: Disclosed is a focus control apparatus for a display. The focus control apparatus comprises an optical engine assembly including a lens, a connection tube, and an optical engine, a tube coupler connected to the connection tube, a tube adjusting bracket for guiding the movement of the tube coupler, and a focusing handle combined with one end of the connection tube so as to adjust the position of the connection tube. The focus control apparatus adjusts the focus of the lens by a simple manipulation using an adjusting knob. The focus control apparatus adjusts the focus of the lens not by the protrusion and the intrusion of the lens but by the backward and forward movement of the connection tube, thereby simplifying the structure, improving the productivity, and reducing the production cost.

Abstract: An integrated circuit package includes an integrated circuit chip having first and second opposing faces and a plurality of pads on the first face of the integrated circuit chip. A plurality of external pins is also included along with a plurality of wires, a respective one of which electrically connects a respective external pin to a respective pad. A conductive lead frame is located adjacent and electrically contacting the second face of the integrated circuit chip. A first wire electrically connects a select one of the pads to the conductive lead frame. A second wire electrically connects a selected one of the pins to the conductive lead frame. Accordingly, power can be distributed to an integrated circuit package with reduced variation across the chip.

Abstract: An integrated circuit package includes an integrated circuit chip having first and second opposing faces and a plurality of pads on the first face of the integrated circuit chip. A plurality of external pins is also included along with a plurality of wires, a respective one of which electrically connects a respective external pin to a respective pad. A conductive lead frame is located adjacent and electrically contacting the second face of the integrated circuit chip. A first wire electrically connects a select one of the pads to the conductive lead frame. A second wire electrically connects a selected one of the pins to the conductive lead frame. Accordingly, power can be distributed to an integrated circuit package with reduced variation across the chip.