Abstract: A slurry dispensing system comprises a first supply station, a second supply station, a first loop, a second loop, a first valve and a second valve. The first loop is selectively connected to the first supply station and the second supply station. The second loop is also selectively connected to the first supply station and the second supply station. The first valve connects the first loop to points of use. The second valve connects the second loop to the points of use. When slurry is supplied to the first loop from the first slurry station, slurry is supplied to the second loop from the second slurry station. When the first valve is opened and the second valve is closed, slurry is supplied to the points of use from the first loop.

Abstract: A slurry dispensing system comprises a first supply station, a second supply station, a first loop, a second loop, a first valve and a second valve. The first loop is selectively connected to the first supply station and the second supply station. The second loop is also selectively connected to the first supply station and the second supply station. The first valve connects the first loop to points of use. The second valve connects the second loop to the points of use. When slurry is supplied to the first loop from the first slurry station, slurry is supplied to the second loop from the second slurry station. When the first valve is opened and the second valve is closed, slurry is supplied to the points of use from the first loop.

Abstract: A wet dip method for photoresist and polymer stripping from a wafer surface without the need for a buffer solvent treatment step is disclosed. In the method, the wafer is first exposed to an etchant solution that is maintained at a temperature of at least 80° C. The wafer is then cooled in a room temperature air for a sufficient length of time until the temperature of the wafer reaches substantially room temperature. The wafer is then rinsed in a rinsing step that includes a quick dump rinse and a final rinse with deionized water that is maintained at a temperature not higher than room temperature without first exposing the wafer to a buffer solvent such as that required in a conventional wet dip method.

Abstract: A wet dip method for photoresist and polymer stripping from a wafer surface without the need for a buffer solvent treatment step is disclosed. In the method, the wafer is first exposed to an etchant solution that is maintained at a temperature of at least 80° C. The wafer is then cooled in a room temperature air for a sufficient length of time until the temperature of the wafer reaches substantially room temperature. The wafer is then rinsed in a rinsing step that includes a quick dump rinse and a final rinse with deionized water that is maintained at a temperature not higher than room temperature without first exposing the wafer to a buffer solvent such as that required in a conventional wet dip method.

Abstract: An apparatus for drying semiconductor wafers in a solvent drying chamber and a method for drying are disclosed. The apparatus is equipped with an alarm/interlocking system such that when a flow of the solvent vapor into the drying chamber is stopped, the alarm is triggered and the interlocking system is activated to stop the further loading of wafers into the drying chamber and thus preventing the outputting of undried wafers from the chamber. The apparatus is used to prevent any malfunction in the flow control valves or in any other flow control system that stops the flow of solvent vapor into the drying chamber.