Abstract: A load port adapted for wafer cassettes of different sizes detects storage states of wafers stored in the wafer cassettes. The load port includes a body, a positioning mechanism, a sensing mechanism, and a detecting mechanism. The body has a carrier base. The positioning mechanism is disposed on the body and has a positioning unit disposed on the carrier base, a hooking unit, and a limiting unit. The hooking unit is disposed in the body and has a driving assembly and a hooking element. The driving assembly is disposed in the body. The hooking element is mounted to the driving assembly. The sensing mechanism is disposed on the carrier base. The detecting mechanism is disposed on the body, detects the storage states of wafers stored in the wafer cassette, and has a first detecting assembly and a second detecting assembly spaced apart from each other.

Abstract: A transport mechanism for wafers of different sizes and types includes a carrier device and a manipulator device. The carrier device has a mounting rack, multiple supporting units, and multiple carrier units. The multiple supporting units are mounted on the mounting rack, and each supporting unit has two supporting bases. Each one of the multiple carrier units has two carrier plates. Each one of the two carrier plates has a connecting rod and two positioning rods. The two positioning rods are respectively located on two sides of the connecting rod. The manipulator device has a driving unit and a manipulator unit. The manipulator unit is mounted on the driving unit and has two arms. Each one of the two arms has a connecting socket and two positioning sockets. The two positioning sockets are respectively located beside the connecting socket. The locking element is movably mounted to the arm.

Abstract: A transport mechanism for wafers of different sizes and types includes a carrier device and a manipulator device. The carrier device has a mounting rack, multiple supporting units, and multiple carrier units. The multiple supporting units are mounted on the mounting rack, and each supporting unit has two supporting bases. Each one of the multiple carrier units has two carrier plates. Each one of the two carrier plates has a connecting rod and two positioning rods. The two positioning rods are respectively located on two sides of the connecting rod. The manipulator device has a driving unit and a manipulator unit. The manipulator unit is mounted on the driving unit and has two arms. Each one of the two arms has a connecting socket and two positioning sockets. The two positioning sockets are respectively located beside the connecting socket. The locking element is movably mounted to the arm.

Abstract: A load port adapted for wafer cassettes of different sizes detects storage states of wafers stored in the wafer cassettes. The load port includes a body, a positioning mechanism, a sensing mechanism, and a detecting mechanism. The body has a carrier base. The positioning mechanism is disposed on the body and has a positioning unit disposed on the carrier base, a hooking unit, and a limiting unit. The hooking unit is disposed in the body and has a driving assembly and a hooking element. The driving assembly is disposed in the body. The hooking element is mounted to the driving assembly. The sensing mechanism is disposed on the carrier base. The detecting mechanism is disposed on the body, detects the storage states of wafers stored in the wafer cassette, and has a first detecting assembly and a second detecting assembly spaced apart from each other.

Abstract: The present disclosure relates to a calibrated laser printing method, which is a pre-laser machining operation of wafers and comprises steps as follows: a piece of calibration glass is carried and leveled by a leveling system; a plurality of target points are marked on the piece of calibration glass by a laser system based on data of default positions of the plurality of target points on the piece of calibration glass; true positions of the target points on the piece of calibration glass are measured by an image system; data of measured true positions is transmitted to a resetting system; the piece of calibration glass is shifted to a next location by a displacement system on which the leveling system is carried for repetitive executions of above steps in the case of measurement not completed; data between default and true positions of the target points is compared; a reflecting mirror is deflected by an angle for calibrations of laser beams projected on a wafer in the case of any offset between default and t

Abstract: The present disclosure relates to a wafer leveling device which comprises a carrier module, a fixture module and a dynamic module. A wafer, which is conveyed to and stays above a claw component of the carrier module by a robotic arm, is further carried by the lifted claw component for a continuous ascent until the wafer is contacted by a ring component of the fixture module; the clamp component of the fixture module releases the ring component; the claw component, the ring component and the wafer, all of which keep stabilized mutual positions, are lowered so that several protrudent structures on a base component of the carrier module contact the wafer; the claw component, the ring component and the wafer which completes a manufacturing process are lifted; the carrier module and the wafer are lowered with the clamp components stabilizing the ring component.

Abstract: The present disclosure relates to a wafer leveling device which comprises a carrier module, a fixture module and a dynamic module. A wafer, which is conveyed to and stays above a claw component of the carrier module by a robotic arm, is further carried by the lifted claw component for a continuous ascent until the wafer is contacted by a ring component of the fixture module; the clamp component of the fixture module releases the ring component; the claw component, the ring component and the wafer, all of which keep stabilized mutual positions, are lowered so that several protrudent structures on a base component of the carrier module contact the wafer; the claw component, the ring component and the wafer which completes a manufacturing process are lifted; the carrier module and the wafer are lowered with the clamp components stabilizing the ring component.

Abstract: The present disclosure relates to a laser marking device and a method thereof. The laser marking device comprises a laser system, a wafer leveling system, a first imaging system and a mobile system: the wafer leveling system carries and levels a warped wafer to be processed; the mobile system underneath properly adjusts a position of the wafer; the first imaging system detects the wafer to recognize a product category and positioning status; the laser system underneath labels laser marks on the wafer; all wafers are marked in the cyclic process.