Abstract: A semiconductor device is located between a first die-set part and a second die-set part of a press, and the first and second die-set parts are moved relative to each other for punching and shaping the semiconductor device therebetween. At least one parameter is monitored with at least one sensor attached to the first die-set part and/or the second die-set part at different positions of the first die-set part when it is moving relative to the second die-set part. Variations of the at least one parameter at different relative positions of the first and second die-set parts are compared, and a failure is determined to have occurred when the present variation of the parameter is different from its expected variation during normal operation of the press when there is no failure.

Abstract: An apparatus and a method for detecting a failure in a press for punching semiconductor devices are provided, where the method comprises the steps of locating a semiconductor device between a first die-set part and a second die-set part comprised in the press, and moving the first die-set part and the second die-set part relative to each other for punching the semiconductor device therebetween.

Abstract: An apparatus for arranging integrated circuit receiving tubes, the apparatus including a reverse mechanism, a detection element and a discharge mechanism. In use, the reverse mechanism receives a tube and the detection element determines an orientation of the received tube. The reverse mechanism moves to allow the discharge mechanism to receive the tube from itself. If the orientation of the received tube differs from a desired orientation, the movement of the reverse mechanism changes the orientation of the tube before allowing the discharge mechanism to receive the tube. Otherwise, the orientation of the tube is maintained notwithstanding the movement of the reverse mechanism, and is subsequently received by the discharge mechanism. This helps to automatically ensure that all the tubes are received by the discharge mechanism in the same orientation.

Abstract: The present invention relates to an apparatus for arranging integrated circuit receiving tubes. The apparatus comprises a reverse mechanism, a detection element and a discharge mechanism. In use, the reverse mechanism receives a tube and the detection element determines an orientation of the received tube. The reverse mechanism moves to allow the discharge mechanism to receive the tube from itself. If the orientation of the received tube differs from a desired orientation, the movement of the reverse mechanism changes the orientation of the tube before allowing the discharge mechanism to receive the tube. Otherwise, the orientation of the tube is maintained notwithstanding the movement of the reverse mechanism, and is subsequently received by the discharge mechanism. This helps to automatically ensure that all the tubes are received by the discharge mechanism in the same orientation.

Abstract: An apparatus for handling electronic components on a lead frame. The apparatus including a singulation device configured to singulate the lead frame to thereby separate the electronic components and to position the separated electronic components alternately into at least two layers along different levels; and a guide having a plurality of lanes running along a surface of the guide, the lanes being configured to transport the separated electronic components from a first end of the guide arranged adjacent to the singulation device to a second end of the guide arranged adjacent to an output area. The lanes at the first end of the guide are alternately arranged into at least two layers having respective levels to receive the electronic components from the singulation device, whereas the lanes at the second end of the guide are arranged into a single layer along a common level for transferring the electronic components to the output area.

Abstract: Disclosed is an apparatus for handling electronic components on a lead frame. The apparatus comprises a singulation device configured to singulate the lead frame to thereby separate the electronic components and to position the separated electronic components alternately into at least two layers along different levels; and a guide having a plurality of lanes running along a surface of the guide, the lanes being configured to transport the separated electronic components from a first end of the guide arranged adjacent to the singulation device to a second end of the guide arranged adjacent to an output area. The lanes at the first end of the guide are alternately arranged into at least two layers having respective levels to receive the electronic components from the singulation device, whereas the lanes at the second end of the guide are arranged into a single layer along a common level for transferring the electronic components to the output area. Also disclosed is a guide suitable for use with the apparatus.