Patents by Inventor Choi Keng Chan

Choi Keng Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit boards having pads for solder balls and methods for the implementation thereof
    Patent number: 8533657
    Abstract: A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after that solder-ball is soldered to that pad. For a pad of that group having a microvia located therein, a center of that microvia is located farther than a center of that pad from its crack initiation point. For a pad of that group having a trace merging along a portion of its perimeter, that portion does not include a vicinity of that crack initiation point.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: September 10, 2013
    Assignee: Intel Corporation
    Inventors: Cheng Siew Tay, Wendy Chet Ming Ngoh, Choi Keng Chan
  • PRINTED CIRCUIT BOARDS HAVING PADS FOR SOLDER BALLS AND METHODS FOR THE IMPLEMENTATION THEREOF
    Publication number: 20110310547
    Abstract: A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after that solder-ball is soldered to that pad. For a pad of that group having a microvia located therein, a center of that microvia is located farther than a center of that pad from its crack initiation point. For a pad of that group having a trace merging along a portion of its perimeter, that portion does not include a vicinity of that crack initiation point.
    Type: Application
    Filed: August 1, 2011
    Publication date: December 22, 2011
    Inventors: Cheng Siew TAY, Wendy Chet Ming NGOH, Choi Keng CHAN
  • Printed circuit boards having pads for solder balls and methods for the implementation thereof
    Patent number: 8079011
    Abstract: A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after that solder-ball is soldered to that pad. For a pad of that group having a microvia located therein, a center of that microvia is located farther than a center of that pad from its crack initiation point. For a pad of that group having a trace merging along a portion of its perimeter, that portion does not include a vicinity of that crack initiation point.
    Type: Grant
    Filed: December 12, 2007
    Date of Patent: December 13, 2011
    Assignee: Intel Corporation
    Inventors: Cheng Siew Tay, Wendy Chet Ming Ngoh, Choi Keng Chan
  • Printed circuit boards having pads for solder balls and methods for the implementation thereof
    Patent number: 7326859
    Abstract: A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after that solder-ball is soldered to that pad. For a pad of that group having a microvia located therein, a center of that microvia is located farther than a center of that pad from its crack initiation point. For a pad of that group having a trace merging along a portion of its perimeter, that portion does not include a vicinity of that crack initiation point.
    Type: Grant
    Filed: December 16, 2003
    Date of Patent: February 5, 2008
    Assignee: Intel Corporation
    Inventors: Cheng Siew Tay, Wendy Chet Ming Ngoh, Choi Keng Chan