Abstract: Only one photo mask defines the metal trench and via region. The mask blocks the UV light in the trench and via area forming Plasma Polymerized Methylsilane Oxide (PPMSO) in the exposed areas. Two step RIE plasma treatment using chlorine gas and oxygen gas removes the Plasma Polymerized Methylsilane (PPMS) in the trench and via regions. Conductive metal is deposited. A CMP process polishes back both excess metal along with the PPMSO, at a similar rate, to form: conducting metal lines, interconnects, and via contacts without metal dishing.

Abstract: A method for the formation of an air gap structure for use in inter-metal applications. A metal pattern of metal lines is formed, a layer of Plasma Polymerized Methylsilane (PPMS) resist is deposited on top of this pattern. The surface of the PPMS resist is subjected to selective exposure. The unexposed PPMS is removed after which the process is completed by closing up the openings within the PPMS.

Abstract: A new method for planarizing silicon dioxide surfaces in semiconductor structures. Starting with a structure of an underlying layer (for instance a layer of metal lines) a layer of oxide is deposited and profiled by positive tone imaging. A layer of PPMS is deposited. Using the mask of the starting structure, the PPMS layer is exposed changing the PPMS to PPMSO in the exposed regions. The unexposed PPMS is removed, the PPMSO (unexposed regions of the PPMS) are planarized, this planarization can proceed to the point where no more PPMSO is present (the PPMSO “columns” are removed together with the intra-layer of patterned oxide). The surface thus created shows excellent planarity, this surface can be further planarized down to the top level of the underlying pattern, if it is desirable to do so.