Patents by Inventor Chong An

Chong An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230386072
    Abstract: Techniques related to 3D pose estimation from a 2D input image are discussed. Such techniques include incrementally adjusting an initial 3D pose generated by applying a lifting network to a detected 2D pose in the 2D input image by projecting each current 3D pose estimate to a 2D pose projection, applying a residual regressor to features based on the 2D pose projection and the detected 2D pose, and combining a 3D pose increment from the residual regressor to the current 3D pose estimate.
    Type: Application
    Filed: December 1, 2020
    Publication date: November 30, 2023
    Applicant: Intel Corporation
    Inventors: Anbang YAO, Yangyuxuan KANG, Shandong WANG, Ming LU, Yurong CHEN, Wenjian SHAO, Yikai WANG, Haojun XU, Chao YU, Chong WONG
  • Publication number: 20230383309
    Abstract: The present invention relates to materials and methods for creating and maintaining a cereal plant line for the production of a hybrid cereal plant, that include for example, and not limitation, using the BLue Aleurone (BLA) system.
    Type: Application
    Filed: May 19, 2023
    Publication date: November 30, 2023
    Applicants: KWS SAAT SE & Co., KGaA, The University of Sydney, Global Crop Innovations Pty. Ltd.
    Inventors: Norman DARVEY, Peng Zhang, Richard Trethowan, Chong Mei Dong, Jacob Lage, Nicholas Bird, Christopher Tapsell, Aaron Hummel
  • Publication number: 20230386299
    Abstract: A system determines a gaming device of a plurality of gaming devices and transmits a message to the gaming device, the message including an invitation to participate in a competitive wagering game. In response to an acceptance of the respective invitation, the gaming device is included in a plurality of active gaming devices and a competitive wagering game is initiated including a plurality of wagering games at the active gaming devices. A plurality of base game results is generated and it is determined whether each base game result is a winning base game result. A winning competitive game result is also selected from the plurality of base game results for the competitive wagering game. For each winning base game result, a base game award is provided at the corresponding gaming device, and a competitive game award is provided at the gaming device associated with the winning competitive game result.
    Type: Application
    Filed: May 25, 2022
    Publication date: November 30, 2023
    Inventors: Nathan AJHAR, Nick HILLSTROM, Yu CHONG
  • Publication number: 20230386459
    Abstract: The application provides an apparatus, platform, method and medium for intention importance interference. The apparatus includes an interface configured to receive user-related information; and a processor coupled to the interface and configured to: extract data related to different aspects of a user from the user-related information; generate a plurality of intention probes based on the data related to different aspects of the user, each intention probe comprising an intention and associated data items; infer an importance of each intention probe by calculating a score of each associated data items of the intention probe based on the data related to different aspects of the user; and provide information associated with an intention probe with a highest importance.
    Type: Application
    Filed: August 18, 2022
    Publication date: November 30, 2023
    Applicant: SoundHound, Inc.
    Inventor: Chong Wang
  • Publication number: 20230387079
    Abstract: Radiation hard semiconductor devices and packaging are disclosed. A semiconductor device assembly includes a substrate, a semiconductor die stack electrically coupled to the substrate, and an ionizing radiation shield disposed over a top die of the semiconductor die stack, wherein the ionizing radiation shield comprises silicon carbide (SiC). The semiconductor device assembly further includes an encapsulant at least partially encapsulating the semiconductor die stack and the ionizing radiation shield.
    Type: Application
    Filed: May 26, 2022
    Publication date: November 30, 2023
    Inventor: Chong Leong Gan
  • Publication number: 20230382713
    Abstract: A micro-electro-mechanical system (MEMS) device includes a first substrate, an interconnect layer, a MEMS device layer, a stopper and a second substrate. The interconnect layer is disposed on the first substrate and includes a plurality of conductive layers and a plurality of dielectric layer stacked alternately. The MEMS device layer is bonded on the interconnect layer and includes a proof mass. The stopper is disposed directly under the proof mass and spaced apart from the proof mass, where the stopper is surrounded by a portion of the interconnect layer, and the stopper includes a bottom portion constructed of one of the plurality of conductive layers, and a silicon-based layer disposed on the bottom portion. The second substrate includes a cavity and is bonded on the MEMS device layer.
    Type: Application
    Filed: May 27, 2022
    Publication date: November 30, 2023
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: RAMACHANDRAMURTHY PRADEEP YELEHANKA, RAKESH CHAND, HUP FONG TAN, ROHIT PULIKKAL KIZHAKKEYIL, WAI MUN CHONG
  • Patent number: 11831907
    Abstract: An image coding method includes: deriving a candidate for a motion vector predictor from a co-located motion vector; adding the candidate to a list; selecting the motion vector predictor from the list; and coding a current block and coding a current motion vector, wherein the deriving includes: deriving the candidate by a first derivation scheme in the case of determining that each of a current reference picture and a co-located reference picture is a long-term reference picture; and deriving the candidate by a second derivation scheme in the case of determining that each of the current reference picture and the co-located reference picture is a short-term reference picture.
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: November 28, 2023
    Assignee: SUN PATENT TRUST
    Inventors: Viktor Wahadaniah, Chong Soon Lim, Sue Mon Thet Naing, Hai Wei Sun, Toshiyasu Sugio, Takahiro Nishi, Hisao Sasai, Youji Shibahara, Kyoko Tanikawa, Toru Matsunobu, Kengo Terada
  • Patent number: 11826927
    Abstract: Disclosed is a recycling apparatus for a cross-linked polyethylene resin using a twin screw extruder. The recycling apparatus for a cross-linked polyethylene resin using a twin screw extruder according to an embodiment of the present disclosure includes: a raw material supply unit configured to supply a raw material that is a cross-linked polyethylene resin; and a twin screw extruder configured to receive the raw material from the raw material supply unit, the twin screw extruder including a cylinder and a twin screw installed inside the cylinder to rotate in the same direction, the twin screw extruder being configured to de-crosslink and recycle the raw material under a de-crosslinking reaction temperature and reaction pressure atmosphere while continuously transporting the raw material along the twin screw by the rotation of the twin screw.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: November 28, 2023
    Assignee: Korea Institute of Science and Technology
    Inventors: Soon Man Hong, Hang Kyu Cho, Seung Sang Hwang, Chong Min Koo, Seon Joon Kim, Albert Lee, Hwan Gyu Lee, Junpyo Hong
  • Patent number: 11826646
    Abstract: A method for providing insurance services to one or more users via a user device, the method including the steps of receiving a plurality of images or a video stream of an environment, overlaying an augmented reality display over the plurality of images or the video stream, presenting the augmented reality display to a user on the user device, identifying one or more risks within the plurality of images or the video stream, presenting the one or more risks to the user on the augmented reality display, determining one or more services to address the one or more identified risks, presenting the one or more services to the user on the augmented reality display, wherein the one or more services being selectable by a user via the augmented reality display.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: November 28, 2023
    Inventor: Yan Tat Chong
  • Patent number: 11827371
    Abstract: An electrical power system for an aircraft includes a DC:AC power electronics converter and a transverse flux electrical machine. The transverse flux electrical machine includes a rotor that is coupleable to a rotating shaft of a propulsor of the aircraft, wherein the rotor includes a plurality of permanent magnets defining a number, NP, of evenly distributed rotor poles. The transverse flux electrical machine further includes a stator arranged to interact with the rotor, such that a torque is produced. The stator includes a plurality of coils.
    Type: Grant
    Filed: May 24, 2023
    Date of Patent: November 28, 2023
    Assignee: Rolls-Royce Deutschland Ltd & Co KG
    Inventors: Ellis F H Chong, Andreas Reeh, Johannes Gabriel Bauer, Anton Rudenko
  • Patent number: 11831341
    Abstract: A compressor includes a logic circuit having transistors of a first channel type to receive a plurality of bit signals, and transistors of a second channel type, different from the first channel type, to receive the plurality of bit signals. The transistors of the first channel type are configured to generate an XOR logic output based on the plurality of bit signals, and the transistors of the second channel type are configured to generate, substantially simultaneous with the generation of the XOR logic output, an XNOR logic output based on the plurality of bit signals. The compressor includes NAND gates to receive multiplicand and multiplier bit signals.
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: November 28, 2023
    Assignee: Arm Limited
    Inventors: Shardendu Shekhar, Andy Wangkun Chen, Yew Keong Chong
  • Publication number: 20230379854
    Abstract: This application provides a data obtaining method and apparatus. The method includes: A data analysis network element in a first network determines that data that needs to be obtained includes to-be-analyzed data in a second network. The data analysis network element sends, to a first network element in the first network, a first request message for requesting to obtain the to-be-analyzed data, where the first request message includes first indication information, and the first indication information indicates that the to-be-analyzed data needs to be obtained from the second network.
    Type: Application
    Filed: August 7, 2023
    Publication date: November 23, 2023
    Inventors: Weiwei CHONG, Xiaobo WU, Yang XIN
  • Publication number: 20230377892
    Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a method for processing a substrate comprises forming a plasma reaction between titanium tetrachloride (TlCl4), hydrogen (H2), and argon (Ar) in a region between a lid heater and a showerhead of a process chamber or the showerhead and a substrate while providing RF power at a pulse frequency of about 5 kHz to about 100 kHz and at a duty cycle of about 10% to about 20% and flowing reaction products into the process chamber to selectively form a titanium material layer upon a silicon surface of the substrate.
    Type: Application
    Filed: May 19, 2022
    Publication date: November 23, 2023
    Inventors: Yiyang WAN, Weifeng YE, Shumao ZHANG, Gary HOW, Jiang LU, Lei ZHOU, Dien-yeh WU, Douglas LONG, Avgerinos V. GELATOS, Ying-Bing JIANG, Rongjun WANG, Xianmin TANG, Halbert CHONG
  • Publication number: 20230380307
    Abstract: A memory device comprising a memory cell comprising a storage element including a phase change memory; and a bilayer formed on a first side and a second side of the memory cell, the bilayer including an inner layer comprising a first nitride and an outer layer comprising a second nitride.
    Type: Application
    Filed: May 20, 2022
    Publication date: November 23, 2023
    Applicant: Intel Corporation
    Inventors: Errol Todd Ryan, Kyuchul Chong, David M. Fryauf, Zhiguo Sun
  • Publication number: 20230378043
    Abstract: Semiconductor devices with three-dimensional trace matching features, and related systems and methods, are disclosed herein. In some embodiments, an exemplary semiconductor device includes at least one semiconductor die and a redistribution layer disposed over the at least one semiconductor die and extending across a longitudinal plane. The redistribution layer includes first and second traces each electrically coupled to the at least one semiconductor die. The first trace is disposed in a first travel path included in a first effective path length. The second trace is disposed in a second travel path different from the first travel path. The second the second travel path includes at least one segment at a non-right, non-zero angle such that the at least one segment is neither parallel nor perpendicular to the longitudinal plane. Further, the second travel path is included in a second effective path length equal to the first path length.
    Type: Application
    Filed: May 20, 2022
    Publication date: November 23, 2023
    Inventors: Chin Hui Chong, Seng Kim Ye, Kelvin Tan Aik Boo, Hong Wan Ng
  • Publication number: 20230372511
    Abstract: The present disclosure relates to a linking unit molecule for targeting molecule-drug conjugate, and the corresponding conjugate, the preparation and use thereof, and in particular relates to an antibody-immune agonist conjugate (AIAC) as a novel type of cancer therapy.
    Type: Application
    Filed: August 7, 2023
    Publication date: November 23, 2023
    Inventors: Paul H. SONG, Gang QIN, Chong LIU
  • Publication number: 20230378128
    Abstract: A semiconductor package having a package substrate including an upper surface, a controller, a first die stack, and a second die stack. The controller, the first die stack, and the second die stack are at the upper surface. The first die stack includes a first shingled sub-stack and a first reverse-shingled sub-stack. The first die stack also includes a first bridging chip between the first shingled and reverse-shingled sub-stacks. The second die stack similarly includes a second shingled sub-stack and a second reverse-shingled sub-stack. The second die stack also includes a second bridging chip bonded to the top of the second reverse-shingled sub-stack. At least a portion of a bottom semiconductor die of the first reverse-shingled sub-stack is vertically aligned with a semiconductor die of the second shingled sub-stack and a semiconductor die of the second reverse-shingled sub-stack.
    Type: Application
    Filed: May 20, 2022
    Publication date: November 23, 2023
    Inventors: Seng Kim Ye, Kelvin Tan Aik Boo, Hong Wan Ng, Chin Hui Chong
  • Publication number: 20230378129
    Abstract: A semiconductor package including a package substrate with an upper surface, a controller, and a die stack. The controller and the die stack are at the upper surface. The die stack includes a shingled sub-stack of semiconductor dies, a reverse-shingled sub-stack of semiconductor dies, and a bridging chip. The bridging chip is bonded between the shingled sub-stack and the reverse-shingled sub-stack, and has an internal trace. A first wire segment is bonded between the controller and a first end of the bridging chip, and a second wire segment is bonded between a second end of the bridging chip and each semiconductor die of the shingled sub-stack. The internal trace electrically couples the first and second wire segments. Additionally, a third wire segment is bonded between the controller and each semiconductor die of the reverse-shingled sub-stack.
    Type: Application
    Filed: May 20, 2022
    Publication date: November 23, 2023
    Inventors: Chin Hui Chong, Seng Kim Ye, Kelvin Tan Aik Boo, Hong Wan Ng
  • Publication number: 20230372180
    Abstract: A rotating cushioning and assisting mechanism comprises a rotating outward expanding member, an elastic return member, and an inner support heterogeneous member; the rotating outward expanding member comprises a first rotating member and a second rotating member, which enclose to form an expandable compartment; the elastic return member is connected to the free ends of the first rotating member and the second rotating member; and the inner support heterogeneous member is rotationally disposed in the expandable compartment. When an external force drives the inner support heterogeneous member to rotate in the expandable compartment, a work done by the force exerted by the inner support heterogeneous member is converted into elastic potential energy to be stored; when the external force is over, the elastic potential energy is released and converted into kinetic energy to help the free ends of the two rotating members to move close.
    Type: Application
    Filed: August 5, 2021
    Publication date: November 23, 2023
    Inventors: Jun Wang, Danping Xiao, Jie Gu, Chong Li
  • Publication number: 20230378800
    Abstract: A solar-powered position tracker includes a load including one or more of a GPS module, a GPS antenna, a GSM module, or a GSM antenna. The load is powered by a rechargeable battery, which may be charged by one or more of a non-rechargeable primary battery and a solar cell. The solar-powered position tracker includes a battery management system for powering the position tracker by controlling the solar cell, rechargeable battery and the non-rechargeable primary battery. The two-stage battery management system charges the rechargeable battery in two stages and includes a solar management and protection circuit interconnecting the solar cell, and the rechargeable battery. The battery management system is configured to execute a charging process for recharging the rechargeable battery from solar cell and protect the rechargeable battery under a high pulse current discharge process to meet a high current or high pulse current discharge demand by the load.
    Type: Application
    Filed: May 18, 2023
    Publication date: November 23, 2023
    Inventors: Cheuk Yin LEE, Yam CHONG, Shengbo LU, Chenmin LIU