Patents by Inventor Chong Cai

Chong Cai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100247802
    Abstract: A method for making device housing comprises: providing a transparent film; forming a coating on one surface of the film by printing ink containing metal powder on the film and ultrasonically treating the coating; and molding a substrate onto the coating.
    Type: Application
    Filed: November 20, 2009
    Publication date: September 30, 2010
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: BEN-DING TSAO, WEN-LIN XIONG, XIAN-MING WU, JIAN-BAO HAN, DIAN-MING ZHU, CHONG CAI