Abstract: A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.

Abstract: Computer-readable media, methods, and systems are disclosed for proactively compiling in-memory database management system (DBMS) query plans upon startup of the in-memory DBMS. During normal operation of the in-memory DBMS, alternative query plans having associated execution statistics are collected and captured. Thereafter, the alternative query plans are selectively persisted and in response to detecting performance regressions, the regressed query plan is compared with prior query plans. In response to determining that a prior query plan performs better, the regressed query plan is replaced with the prior query plan. Upon a restart of the in-memory DBMS, a selected portion of the plurality of alternative query execution plans is loaded, and the plurality of alternative query execution plans are compiled. New queries are received and executed based on the proactively compiled query plans.

Abstract: Systems and methods are disclosed for controlling a downhole tool by encoding a tool control signal in a fluid flow and obtaining a temperature response downhole. In an example, a system for controlling a downhole tool includes a signal transmitter, a signal receiver, and a controller. The signal transmitter is uphole of the tool to be controlled (e.g., at surface) and encodes the tool control signal by varying one or more fluid flow parameters of a fluid flow down a well. The signal receiver is positionable in the well in fluid communication with the fluid flow. The signal receiver detects a temperature response in the fluid flow resulting from varying the one or more fluid flow parameters. A controller controls the downhole tool according to the temperature response.

Abstract: Systems and methods are disclosed for controlling a downhole tool by encoding a tool control signal in a fluid flow and obtaining a temperature response downhole. In an example, a system for controlling a downhole tool includes a signal transmitter, a signal receiver, and a controller. The signal transmitter is uphole of the tool to be controlled (e.g., at surface) and encodes the tool control signal by varying one or more fluid flow parameters of a fluid flow down a well. The signal receiver is positionable in the well in fluid communication with the fluid flow. The signal receiver detects a temperature response in the fluid flow resulting from varying the one or more fluid flow parameters. A controller controls the downhole tool according to the temperature response.

Abstract: Computer-readable media, methods, and systems are disclosed for proactively compiling in-memory database management system (DBMS) query plans upon startup of the in-memory DBMS. During normal operation of the in-memory DBMS, alternative query plans having associated execution statistics are collected and captured. Thereafter, the alternative query plans are selectively persisted and in response to detecting performance regressions, the regressed query plan is compared with prior query plans. In response to determining that a prior query plan performs better, the regressed query plan is replaced with the prior query plan. Upon a restart of the in-memory DBMS, a selected portion of the plurality of alternative query execution plans is loaded, and the plurality of alternative query execution plans are compiled. New queries are received and executed based on the proactively compiled query plans.

Abstract: Modular stabilizer tools may be used to reduce unwanted deflection of a wellbore and in effecting a desired change in direction of a wellbore in an efficient and inexpensive manner. As the diameter of a wellbore changes, the modular stabilizers plates may be configured to expand or decrease the outer diameter of a modular stabilizer tool without requiring removal of an entire section of the drill string. Each modular stabilizer plate of a modular stabilizer tool may be configured to align and affix to any one or more other modular stabilizer plates and may be of any size or shape. A site need only maintain a small inventory of modular stabilizer plates instead of entire collars, tools, or sections of a drill string. When any modular stabilizer plate, especially an outer spacer stabilizer plate, experiences wear or damage, it may be replaced without the requirement of replacing an entire collar.

Abstract: Modular stabilizer tools may be used to reduce unwanted deflection of a wellbore and in effecting a desired change in direction of a wellbore in an efficient and inexpensive manner. As the diameter of a wellbore changes, the modular stabilizers plates may be configured to expand or decrease the outer diameter of a modular stabilizer tool without requiring removal of an entire section of the drill string. Each modular stabilizer plate of a modular stabilizer tool may be configured to align and affix to any one or more other modular stabilizer plates and may be of any size or shape. A site need only maintain a small inventory of modular stabilizer plates instead of entire collars, tools, or sections of a drill string. When any modular stabilizer plate, especially an outer spacer stabilizer plate, experiences wear or damage, it may be replaced without the requirement of replacing an entire collar.

Abstract: A capacitive isolation system, capacitive isolator, and method of operating the same are disclosed. The capacitive isolation system is described to include a first semiconductor die and a second semiconductor die each having capacitive elements established thereon and positioned in a face-to-face configuration. An isolation layer is provided between the first and second semiconductor die so as to establish an isolation boundary therebetween. Capacitive coupling is used to carry information across the isolation boundary.

Abstract: An isolation device having first and second semiconductor is disclosed. The first semiconductor die may be adapted to transmit a first signal to the second semiconductor die that is electrically isolated. The first semiconductor die may have a transmitter coupled to a modulator that modulates the first signal. The second semiconductor die may have a receiver having a counter and a control circuit. The control circuit may be adapted to determine an indication of the first signal by using the counter. In addition, an isolation system and a DC-DC feedback regulation control system having such control circuit are disclosed. Likewise, a method for conveying a first signal across an isolation barrier is disclosed. The method may comprise counting a received signal based on internal clock and determining an indication of the first signal from the counter's count value.

Abstract: Various embodiments of systems for transmitting and receiving a plurality of signals across an isolation material are disclosed. In one embodiment, a first signal may be modulated into a first modulated signal. The first modulated signal is then modulated into a second modulated signal in accordance to a second signal using amplitude modulation. In another embodiment, a first signal and a second signal are modulated into a modulated signal before being modulated further using amplitude modulation. The detection of the modulated signal may be performed using a frequency detector and an amplitude detection circuit that are arranged in parallel. At least some of the apparatuses, circuits, systems and methods disclosed herein may be implemented using conventional CMOS design and manufacturing techniques to provide, for example, at least one or more integrated circuits.

Abstract: A capacitive isolation system, capacitive isolator, and method of operating the same are disclosed. The capacitive isolation system is described to include a first semiconductor die and a second semiconductor die each having capacitive elements established thereon and positioned in a face-to-face configuration. An isolation layer is provided between the first and second semiconductor die so as to establish an isolation boundary therebetween. Capacitive coupling is used to carry information across the isolation boundary.

Abstract: Various embodiments of systems for transmitting and receiving a plurality of signals across an isolation material are disclosed. In one embodiment, a first signal may be modulated into a first modulated signal. The first modulated signal is then modulated into a second modulated signal in accordance to a second signal using amplitude modulation. In another embodiment, a first signal and a second signal are modulated into a modulated signal before being modulated further using amplitude modulation. The detection of the modulated signal may be performed using a frequency detector and an amplitude detection circuit that are arranged in parallel. At least some of the apparatuses, circuits, systems and methods disclosed herein may be implemented using conventional CMOS design and manufacturing techniques to provide, for example, at least one or more integrated circuits.

Abstract: An isolation device having first and second semiconductor is disclosed. The first semiconductor die may be adapted to transmit a first signal to the second semiconductor die that is electrically isolated. The second semiconductor die may have a receiver having a counter and a control circuit. Each of the first and second semiconductor dies may have a clock generator respectively adapted to generate substantially similar clock frequency in order to transmit or to receive the first signal. In addition, an isolation system and a DC-DC feedback regulation control system having such first and second clock generators are disclosed. Likewise, a method for conveying a first signal across an isolation barrier is disclosed. The method may comprise generating a first clock signal for transmitting the first signal and generating a second clock signal for receiving the first signal.

Abstract: An isolation device having first and second semiconductor is disclosed. The first semiconductor die may be adapted to transmit a first signal to the second semiconductor die that is electrically isolated. The first semiconductor die may have a transmitter coupled to a modulator that modulates the first signal. The second semiconductor die may have a receiver having a counter and a control circuit. The control circuit may be adapted to determine an indication of the first signal by using the counter. In addition, an isolation system and a DC-DC feedback regulation control system having such control circuit are disclosed. Likewise, a method for conveying a first signal across an isolation barrier is disclosed. The method may comprise counting a received signal based on internal clock and determining an indication of the first signal from the counter's count value.

Abstract: Various embodiments of systems for transmitting and receiving digital and/or analog signals across a single isolator, solid state lighting systems, or DC/DC converter feedback regulation control systems are disclosed. In one embodiment, a first signal may be modulated into a first modulated signal. The first modulated signal is then modulated into a second modulated signal in accordance to a second signal. The second modulated signal is in turn, modulated into a third modulated signal in accordance to a third signal. At least some of the apparatuses, circuits, systems and methods disclosed herein may be implemented using conventional CMOS design and manufacturing techniques and processes to provide, for example, at least one or more integrated circuits.

Abstract: Various embodiments of systems for transmitting and receiving digital and/or analog signals across a single isolator, solid state lighting systems, or DC/DC converter feedback regulation control systems are disclosed. In one embodiment, a first signal may be modulated into a first modulated signal. The first modulated signal is then modulated into a second modulated signal in accordance to a second signal. The second modulated signal is in turn, modulated into a third modulated signal in accordance to a third signal. At least some of the apparatuses, circuits, systems and methods disclosed herein may be implemented using conventional CMOS design and manufacturing techniques and processes to provide, for example, at least one or more integrated circuits.

Abstract: Various embodiments of systems for transmitting and receiving digital and Various embodiments of systems for transmitting and receiving digital and/or analog signals across a single isolator, solid state lighting systems, or DC/DC converter feedback regulation control systems are disclosed. In one embodiment, the digital and analog signals may be modulated into a frequency modulated signal, and each pulse of the frequency modulated signal may be further encoded into a major pulse and a minor pulse. At least some of the circuits, systems and methods disclosed herein may be implemented using conventional CMOS design and manufacturing techniques and processes to provide, for example, a single integrated circuit or ASIC.

Abstract: An optical transmission module includes a semiconductor substrate, a first film layer, an electronic component layer and a waveguide structure. The electronic component layer is used for converting a first electrical signal into an optical signal. The waveguide structure is formed on the first film layer, and includes a first reflective surface, a waveguide body and a second reflective surface. After the optical signal is transmitted through the semiconductor substrate and the first film layer and enters the waveguide structure, the optical signal is reflected by the first reflective surface, transmitted within the waveguide body and reflected by the second reflective surface. After the optical signal reflected by the second reflective surface is transmitted through the first film layer and the semiconductor substrate and received by the electronic component layer, the optical signal is converted into a second electrical signal by the electronic component layer.

Abstract: The optical coupler module for converting and transmitting electrical/optical signals includes a semiconductor substrate, a first film, a second film, an electrical transmission unit, at least one signal conversion unit and an optical waveguide structure. The first film and the second film are formed on opposite surfaces of the semiconductor substrate. The signal conversion unit and the optical waveguide structure are disposed on opposite sides of the semiconductor substrate. The optical waveguide structure has a reflector and a waveguide body. The optical signal generated from the signal conversion unit sequentially passes the first film, the semiconductor substrate and the second film and enters the optical waveguide structure. Then, the optical signal is reflected by the reflector and transmitted in the waveguide body to be outputted. Alternatively, the optical signal is transmitted in a reverse direction from the optical waveguide structure to the signal conversion unit.

Abstract: An optical coupler module includes a semiconductor substrate disposed on the print circuit board; a reflecting trench structure formed on the semiconductor substrate; a reflector formed on a slant surface of the reflecting trench structure; a strip trench structure formed on the semiconductor substrate and connecting with the reflecting trench structure; a thin film disposed on the above-mentioned structure. The optical coupler module further includes a signal conversion unit disposed on the semiconductor substrate and the position of the signal conversion unit corresponds to the reflector; and an optical waveguide structure formed in the trench structures. The optical signal from the signal conversion unit is reflected by the reflector and then transmitted in the optical waveguide structure, or in a reverse direction to reach the signal conversion unit.