Patents by Inventor Chong Chen Gary Lim

Chong Chen Gary Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for processing sputtered IC units
    Patent number: 10907247
    Abstract: A method for preparing a film carrier for sputtering of IC units placed thereon, the method comprising the steps of: providing a carrier of IC units; removing said units from the carrier; delivering said IC units to a flipper; inverting and delivering said units to a sputtering film frame; placing the units on said sputtering film frame in an array having a pre-determined clearance about adjacent units.
    Type: Grant
    Filed: August 12, 2015
    Date of Patent: February 2, 2021
    Assignee: ROKKO SYSTEMS PTE LTD
    Inventors: Chong Chen Gary Lim, Seung Ho Baek, Jong Jae Jung, Yun Suk Shin, Deok Chun Jang
  • APPARATUS AND METHOD FOR PROCESSING SPUTTERED IC UNITS
    Publication number: 20170260623
    Abstract: A method for preparing a film carrier for sputtering of IC units placed thereon, the method comprising the steps of: providing a carrier of IC units; removing said units from the carrier; delivering said IC units to a flipper; inverting and delivering said units to a sputtering film frame; placing the units on said sputtering film frame in an array having a pre-determined clearance about adjacent units.
    Type: Application
    Filed: August 12, 2015
    Publication date: September 14, 2017
    Inventors: Chong Chen Gary LIM, Seung Ho James BAEK, Jong Jae JUNG, Yun Suk SHIN, Deok Chun JANG
  • Assembly and method for IC unit engagement
    Patent number: 8997592
    Abstract: A picker assembly includes a plurality of pickers in selective variable spaced relation, a shaft having a plurality of cam plates, the cam plates co-axial with said shaft and having a variable thickness. The cam plates are in engagement with the pickers and positioned in interstitial spaces between the pickers. The selective variability in spacing is provided by rotation of the shaft such that thickness variation of the cam plates move the respective pickers along an axis parallel to the shaft.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: April 7, 2015
    Assignee: Rokko Systems Pte Ltd
    Inventors: Hae Choon Yang, Jong Jae Jung, Deok Chun Jang, Chong Chen Gary Lim
  • ASSEMBLY AND METHOD FOR IC UNIT ENGAGEMENT
    Publication number: 20120260752
    Abstract: A picker assembly includes a plurality of pickers in selective variable spaced relation, a shaft having a plurality of cam plates, the cam plates co-axial with said shaft and having a variable thickness. The cam plates are in engagement with the pickers and positioned in interstitial spaces between the pickers. The selective variability in spacing is provided by rotation of the shaft such that thickness variation of the cam plates move the respective pickers along an axis parallel to the shaft.
    Type: Application
    Filed: December 23, 2010
    Publication date: October 18, 2012
    Applicant: ROKKO SYSTEMS PTE LTD
    Inventors: Hae Choon Yang, Jong Jae Jung, Deck Chun Jang, Chong Chen Gary Lim