Abstract: A punching system for singulating IC units comprising: a punching assembly arranged to receive a substrate and singulate said substrate into the IC units; a rotary carrier rotatable from a first position to a second position said rotary carrier arranged to receive said units at the first position and carry said units to the second position through rotation; wherein said rotary carrier includes recesses for receiving at least a portion of the units. A punching assembly comprising a die block having recesses for receiving selectively replaceable inserts wherein said inserts correspond to a punch pattern specific to a predetermined IC package arrangement.

Abstract: An assembly for cutting a plurality of substrates into individual integrated circuit units includes a first block for receiving a first substrate. The first block is movable between a first loading position, a first alignment inspection station and a first cutting zone. A second block for receiving a second substrate is movable between a second loading position, a second alignment inspection station and a second cutting zone. A cutting device for cutting a substrate into individual integrated circuit units is movable between the first cutting zone and the second cutting zone. An alignment inspection device for determining the alignment of a substrate positioned on either the first or second block is movable between the first alignment inspection station and the second alignment inspection station.

Abstract: A system for cutting a plurality of substrates of integrated circuit units comprising a plurality of tables (40, 55), each table including a plurality of trays (37A, 37B, 57A, 57B), each tray arranged to receive one of said substrates; each of said tables selectively movable between a respective loading station (20) for receiving said substrates and a cutting station for cutting the substrates, and a substrate placement device (35) for placing the substrates on the respective trays of said tables; wherein the substrate placement device is arranged to sequentially place substrates on said tables with said tables arranged to sequentially move to the cutting station after receiving the substrates and then return to their respective loading stations for placement of additional substrates.