Abstract: A conductive paste includes: at least one metal powder, an organic vehicle, a glass and a surfactant having a representative formula as follows: Mx(R)y(Q)z, wherein M is selected from a metal element and a semiconductive element, R is hydrophilic group directly connected to M and one will be able to hydrolyze by water to form another hydrophilic group, and Q is a hydrophobic group. The hydrophilic functional group of the surfactant will attach on the metal powder surface closely. Therefore, the surfactant can disperse the metal powder in the organic vehicle well and prevent paste from aggregating.