Patents by Inventor Chong H. Park

Chong H. Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11268397
    Abstract: A fan blade platform seal includes a platform portion including a first side and a second side opposite the first side. The platform portion further includes a flow path surface extending between the first side and the second side and a bonding surface opposite the flow path surface. The fan blade platform seal further includes a first seal portion including a first bonding segment including a first outer surface, mounted to the platform portion on the first side of the platform portion, and a first inner surface opposite the first outer surface. The fan blade platform seal further includes a stiffening portion mounted to the first inner surface. The stiffening portion includes a first bonding layer bonded to the first inner surface and a stiffening layer bonded to the first bonding layer on a first layer side of the stiffening layer.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: March 8, 2022
    Assignee: Raytheon Technologies Corporation
    Inventors: Jordan J. Franklin, Peter Karkos, David R. Lyders, Chong H. Park, Matthew R. Zsunkan
  • Publication number: 20210246798
    Abstract: A fan blade platform seal includes a platform portion including a first side and a second side opposite the first side. The platform portion further includes a flow path surface extending between the first side and the second side and a bonding surface opposite the flow path surface. The fan blade platform seal further includes a first seal portion including a first bonding segment including a first outer surface, mounted to the platform portion on the first side of the platform portion, and a first inner surface opposite the first outer surface. The fan blade platform seal further includes a stiffening portion mounted to the first inner surface. The stiffening portion includes a first bonding layer bonded to the first inner surface and a stiffening layer bonded to the first bonding layer on a first layer side of the stiffening layer.
    Type: Application
    Filed: February 7, 2020
    Publication date: August 12, 2021
    Inventors: Jordan J. Franklin, Peter Karkos, David R. Lyders, Chong H. Park, Matthew R. Zsunkan
  • Patent number: 10036278
    Abstract: In various embodiments, a high pressure compressor may comprise a thermal shield. The thermal shield may be installed between a first rotor and a second rotor. The thermal shield may also be installed radially inward of a stator. The stator may be a shrouded stator. Moreover, the thermal shield may be configured to thermally isolate and/or reduce the thermal load associated with windage on a rotor hub.
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: July 31, 2018
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventors: Brad Powell, Chong H. Park
  • Publication number: 20150292353
    Abstract: In various embodiments, a high pressure compressor may comprise a thermal shield. The thermal shield may be installed between a first rotor and a second rotor. The thermal shield may also be installed radially inward of a stator. The stator may be a shrouded stator. Moreover, the thermal shield may be configured to thermally isolate and/or reduce the thermal load associated with windage on a rotor hub.
    Type: Application
    Filed: March 23, 2015
    Publication date: October 15, 2015
    Applicant: UNITED TECHNOLOGIES CORPORATION
    Inventors: BRAD POWELL, CHONG H. PARK
  • Patent number: 5539830
    Abstract: A mounting structure for an integral vibration element to which a wire having a hook, a magnet, a cushion rubber ring and a vibration spring stopper are fitted, wherein the integral vibration element is inserted to a U-shaped boss and then the inserted portion of the integral vibration element is simply close up tight with a corresponding cover plate so that the assembling process may be separated and furthermore, since the working time required for the first process is decreased, mass production may be possible with the less number of workers.
    Type: Grant
    Filed: October 19, 1994
    Date of Patent: July 23, 1996
    Inventor: Chong H. Park