Patents by Inventor Chong Hai Lee

Chong Hai Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die attach for light emitting diode
    Patent number: 7075233
    Abstract: Improved LED die mount. By mounting an LED die on a pedestal which is smaller than the LED die, formation of fillets of die mount material which would block some of the light from the LED die are reduced or eliminated.
    Type: Grant
    Filed: July 10, 2003
    Date of Patent: July 11, 2006
    Inventors: Kee Yean Ng, Teong Heng Sim, Chong Hai Lee
  • Adhesive die attachment method for a semiconductor die and arrangement for carrying out the method
    Patent number: 6967123
    Abstract: The invention relates to an adhesive attaching method for attaching a semiconductor die to a substrate in which an adhesive is deposited onto the substrate, the deposited adhesive is partially cured and/or dried, the partially cured and/or dried adhesive is reheated and a semiconductor die is placed onto the reheated adhesive, after which the adhesive is fully cured so that the semiconductor die is bonded, both electrically and mechanically, to the substrate.
    Type: Grant
    Filed: February 20, 2003
    Date of Patent: November 22, 2005
    Assignee: Agilent Technologies, Inc.
    Inventors: Kee Yean Ng, Keh Chin Seah, Chong Hai Lee
  • Adhesive die attachment method for a semiconductor die and arrangement for carrying out the method
    Publication number: 20030194831
    Abstract: The invention relates to an adhesive attaching method for attaching a semiconductor die to a substrate in which an adhesive is deposited onto the substrate, the deposited adhesive is partially cured and/or dried, the partially cured and/or dried adhesive is reheated and a semiconductor die is placed onto the reheated adhesive, after which the adhesive is fully cured so that the semiconductor die is bonded, both electrically and mechanically, to the substrate.
    Type: Application
    Filed: February 20, 2003
    Publication date: October 16, 2003
    Inventors: Kee Yean Ng, Keh Chin Seah, Chong Hai Lee