Patents by Inventor Chong-Ho Kim
Chong-Ho Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11507320Abstract: A USB-based cloud disk according to an embodiment is connected with a computer, and, when a write command on a sector is received from the computer, the USB-based cloud disk transmits data regarding the sector and a data path regarding the sector data to a remote repository.Type: GrantFiled: April 22, 2021Date of Patent: November 22, 2022Assignees: OPENBOXLAB INC.Inventor: Chong Ho Kim
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Publication number: 20210294532Abstract: A USB-based cloud disk according to an embodiment is connected with a computer, and, when a write command on a sector is received from the computer, the USB-based cloud disk transmits data regarding the sector and a data path regarding the sector data to a remote repository.Type: ApplicationFiled: April 22, 2021Publication date: September 23, 2021Inventor: Chong Ho KIM
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Patent number: 7758228Abstract: A backlight unit of an LCD device is disclosed in which a light-diffusion substance below a light-guiding plate is formed as one body with a reflecting sheet by using a photonic crystal reflecting sheet to improve color purity. The backlight unit includes a lamp; a photonic crystal reflecting sheet having a plurality of parts; and a plurality of sheets formed above the photonic crystal reflecting sheet. Each part of the photonic crystal reflecting sheet includes a photonic crystal for selectively reflecting the light of a predetermined wavelength in the light emitted from the lamp. The wavelengths are different, thereby permitting the photonic crystal to reflect different colors in different areas.Type: GrantFiled: June 30, 2005Date of Patent: July 20, 2010Assignee: LG. Display Co., Ltd.Inventor: Chong Ho Kim
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Patent number: 7629692Abstract: A via hole having a fine hole land includes a first conductive layer formed on an inner wall of the via hole, the first conductive layer being in contact with a hole formed in an insulation layer and extendedly projected to the outside and having the same diameter as the hole in the insulation layer; a second conductive layer contacted with the first conductive layer and formed on an inner wall thereof and projected to the outside and having the same height as the first conductive layer; and a circuit line, formed on the insulation layer, to connect the first conductive layer extendedly projected to the outside of hole in the insulation layer, where the second conductive layer has the same height as the first conductive layer and the fine hole land is connected to wire bonding pad or solder ball pad through the circuit line.Type: GrantFiled: July 12, 2006Date of Patent: December 8, 2009Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Chong Ho Kim, Jong Min Choi, Young Hwan Shin
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Publication number: 20080209722Abstract: A method for forming a via hole having a fine hole land with which the density of circuit patterns can be increased. The method includes forming a via hole in a copper clad laminate, coating an etching resist over the copper clad laminate, and forming a circuit pattern on the copper foil of the copper clad laminate; forming a seed layer, coating a photoresist, and exposing an inner wall of the via hole; and forming a plated layer on the inner wall of the via hole and removing the photoresist and the seed layer.Type: ApplicationFiled: February 6, 2008Publication date: September 4, 2008Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Chong Ho Kim, Jong Min Choi, Young Hwan Shin
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Patent number: 7346982Abstract: A method is directed towards fabricating a printed circuit board (PCB) having a thin core layer. In the method, a substrate, where a copper foil is formed on a release film and a prepreg, is employed as a base substrate and a core insulating layer is removed after the fabrication of the PCB, thereby reducing the thickness of the final product.Type: GrantFiled: March 22, 2005Date of Patent: March 25, 2008Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Chong Ho Kim, Dong Kuk Kim, Hyo Soo Lee, Young Hwan Shin
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Patent number: 7298887Abstract: A system for and a method of analyzing the surface condition of a PCB using RGB colors are disclosed. The analyzing method includes the steps of feeding a target PCB, to be measured, to an image pick-up position where a pick-up unit is disposed, by a feeding unit, picking up an image of a metal surface of the fed target PCB, extracting pixel data from the picked-up image for the target PCB, performing a mapping operation for RGB signals of the extracted pixel data in accordance with a mapping program, thereby determining relative RGB values, producing cumulative distribution data of the relative RGB values for the target PCB in accordance with an RGB-mapping process, and quantitatively determining the oxidation degree of the target PCB metal surface exhibited with the lapse of time, based on the cumulative distribution data.Type: GrantFiled: September 24, 2003Date of Patent: November 20, 2007Assignee: Samsung Electro-Mechanics Co., LtdInventors: Hyo-Soo Lee, Young-Hwan Shin, Chong-Ho Kim
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Patent number: 7030500Abstract: A package substrate of, for example, a BGA type or a CSP type, manufactured by carrying out an electrolytic Au plating process without using any plating lead line for formation of bond fingers and solder ball pads, and a method for manufacturing the package substrate.Type: GrantFiled: January 13, 2005Date of Patent: April 18, 2006Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Young-Hwan Shin, Chong-Ho Kim, Tae-Gui Kim
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Publication number: 20050194696Abstract: A package substrate of, for example, a BGA type or a CSP type, manufactured by carrying out an electrolytic Au plating process without using any plating lead line for formation of bond fingers and solder ball pads, and a method for manufacturing the package substrate.Type: ApplicationFiled: January 13, 2005Publication date: September 8, 2005Inventors: Young-Hwan Shin, Chong-Ho Kim, Tae-Gui Kim
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Patent number: 6852625Abstract: A package substrate of, for example, a BGA type or a CSP type, manufactured by carrying out an electrolytic Au plating process without using any plating lead line for formation of bond fingers and solder ball pads, and a method for manufacturing the package substrate.Type: GrantFiled: July 14, 2003Date of Patent: February 8, 2005Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Young-Hwan Shin, Chong-Ho Kim, Tae-Gui Kim
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Publication number: 20040234119Abstract: A system for and a method of analyzing the surface condition of a PCB using RGB colors are disclosed. The analyzing method includes the steps of feeding a target PCB, to be measured, to an image pick-up position where a pick-up unit is disposed, by a feeding unit, picking up an image of a metal surface of the fed target PCB, extracting pixel data from the picked-up image for the target PCB, performing a mapping operation for RGB signals of the extracted pixel data in accordance with a mapping program, thereby determining relative RGB values, producing cumulative distribution data of the relative RGB values for the target PCB in accordance with an RGB-mapping process, and quantitatively determining the oxidation degree of the target PCB metal surface exhibited with the lapse of time, based on the cumulative distribution data.Type: ApplicationFiled: September 24, 2003Publication date: November 25, 2004Inventors: Hyo-Soo Lee, Young-Hwan Shin, Chong-Ho Kim
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Publication number: 20040113244Abstract: A package substrate of, for example, a BGA type or a CSP type, manufactured by carrying out an electrolytic Au plating process without using any plating lead line for formation of bond fingers and solder ball pads, and a method for manufacturing the package substrate.Type: ApplicationFiled: July 14, 2003Publication date: June 17, 2004Applicant: Samsung Electro-Mechanics Co., LtdInventors: Young-Hwan Shin, Chong-Ho Kim, Tae-Gui Kim
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Patent number: 5965106Abstract: A method for in-vivo targeting a functional moiety in a patient by administering a targeting moiety coupled to an affinity component, wherein the targeting moiety has affinity for binding sites in a target area, and administering a binding partner to the affinity component coupled to a functional moiety to localize the functional moiety in the target area. Preferably the targeting moiety is an antibody and the functional moiety is a radiometal when performing in vivo imaging or therapy. The affinity component may be a novel methotrexate analog. Preferably, the affinity component is thermo-stabilized.Type: GrantFiled: June 5, 1995Date of Patent: October 12, 1999Assignee: PerImmune Holdings, Inc.Inventors: Nicholas Pomato, Richard P. McCabe, Gregory A. Hawkins, Reinhard Bredehorst, Chong-Ho Kim, Carl-Wilhelm Vogel
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Patent number: 5807534Abstract: A method for in-vivo targeting a functional moiety in a patient by administering a targeting moiety coupled to an affinity component, wherein the targeting moiety has affinity for binding sites in a target area, and administering a binding partner to the affinity component coupled to a functional moiety to localize the functional moiety in the target area. Preferably the targeting moiety is an antibody and the functional moiety is a radiometal when performing in vivo imaging or therapy. The affinity component may be a novel methotrexate analog.Type: GrantFiled: May 30, 1995Date of Patent: September 15, 1998Assignee: Akzo Nobel N.V.Inventors: Nicholas Pomato, Richard P. McCabe, Gregory Alan Hawkins, Reinhard Bredehorst, Chong-Ho Kim, Carl-Wilhelm Ernst Vogel
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Patent number: 5578289Abstract: A method for in-vivo targeting a functional moiety in a patient by administering a targeting moiety coupled to an affinity component, wherein the targeting moiety has affinity for binding sites in a target area, and administering a binding partner to the affinity component coupled to a functional moiety to localize the functional moiety in the target area. Preferably the targeting moiety is an antibody and the functional moiety is a radiometal when performing in vivo imaging or therapy. The affinity component may be a novel methotrexate analog.Type: GrantFiled: November 4, 1993Date of Patent: November 26, 1996Assignee: Akzo N.V.Inventors: Nicholas Pomato, Richard P. McCabe, Gregory A. Hawkins, Reinhard Bredehorst, Chong-Ho Kim, Carl-Wilhelm E. Vogel
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Patent number: 5433955Abstract: A method for site-specific in-vivo activation of a prodrug in an animal using an activator-targeting moiety conjugate to localize an activator at a predetermined site of use and a prodrug compound that is converted to an active drug in the presence of the activator. In the preferred embodiment, the targeting moiety, the activator, and the prodrug demonstrate little or no immunogenicity in the animal being treated. The targeting moiety is relatively specific for binding to the target tissue than to non-target tissue. The activator is not found or present in only small amounts in circulation or in non-target tissue, does not have a substrate for its activity in circulation or in non-target tissue, can be linked to the targeting moiety, and is capable of converting the prodrug to an active drug. The prodrug is selected for its ability to exert a cytotoxic activity on the target tissue after conversion by the activator.Type: GrantFiled: October 8, 1993Date of Patent: July 18, 1995Assignee: Akzo N.V.Inventors: Reinhard Bredehorst, Chong-Ho Kim, Richard McCabe, Nicholas Pomato, Carl-Wilhelm Vogel
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Patent number: 4788181Abstract: 5-substituted 2',3'-dideoxycytidine compounds and their monophosphates are disclosed which have been found to have potent activity against retroviruses. The 5-fluoro-and 5-aza-substituted 2',3'-dideoycytidine compounds have been found to be effective against HTLV-III/LAV virus.Type: GrantFiled: September 29, 1986Date of Patent: November 29, 1988Assignee: The United States of America as represented by the Department of Health and Human ServicesInventors: John S. Driscoll, Victor E. Marquez, Chong-Ho Kim, James A. Kelley