Patents by Inventor Chong J. Lim

Chong J. Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for the production of highly pure copper thin films by chemical vapor deposition
    Patent number: 5441766
    Abstract: The present invention relates to a method for the production of highly pure copper thin films free from carbonaceous impurities, which comprises depositing a thin copper film using an organic copper compound precursor containing ketoesters alone or in combination with a Lewis base as ligands, by which the ligands are not thermally decomposed during the vapor deposition.
    Type: Grant
    Filed: August 25, 1994
    Date of Patent: August 15, 1995
    Assignee: Korea Institute of Science and Technology
    Inventors: Hyung S. Choi, Young S. Cho, Chong J. Lim, Soon T. Hwang