Patents by Inventor Chong K. Lai

Chong K. Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High thermal resistance bonding material and semiconductor structures using same
    Patent number: 4888634
    Abstract: A high thermal resistance bonding material for semiconductor chips includes a binder such as epoxy or polyimide and high thermal resistance material dispersed therein such as glass micropheres, glass beads, ceramic microspheres and ceramic beads. The particles of high thermal resistance material are sieved to obtain particles of generally uniform size. In plastic-encapsulated semiconductor chips, each chip is enveloped by the bonding material.
    Type: Grant
    Filed: February 3, 1989
    Date of Patent: December 19, 1989
    Assignee: Linear Technology Corporation
    Inventors: Chong K. Lai, Robert C. Dobkin