Abstract: An optical electrical device comprises a base and a transparent conductive structure on the base is disclosed. The base further comprises a light-emitting device and the transparent conductive structure comprises a transparent conductive oxide layer and a passivation layer on the transparent conductive oxide layer. The material of the transparent conductive oxide layer comprises transparent conductive metal oxide, such as ZnO. Furthermore, the transparent conductive metal oxide also comprises impurities, such as a carrier e.g. gallium.

Abstract: An optical electrical device comprises a base and a transparent conductive structure on the base is disclosed. The base further comprises a light-emitting device and the transparent conductive structure comprises a transparent conductive oxide layer and a passivation layer on the transparent conductive oxide layer. The material of the transparent conductive oxide layer comprises transparent conductive metal oxide, such as ZnO. Furthermore, the transparent conductive metal oxide also comprises impurities, such as a carrier e.g. gallium.

Abstract: An optical electrical device comprises a base and a transparent conductive structure on the base is disclosed. The base further comprises a light-emitting device and the transparent conductive structure comprises a transparent conductive oxide layer and a passivation layer on the transparent conductive oxide layer. The material of the transparent conductive oxide layer comprises transparent conductive metal oxide, such as ZnO. Furthermore, the transparent conductive metal oxide also comprises impurities, such as a carrier e.g. gallium.

Abstract: An integrated circuit having compact high-speed bus lines consists of VCSEL Array providing optical fiber holes, PIN Array providing optical fiber holes, and multi-mode optical fiber with great diameter optical core, wherein the VCSEL Array providing optical fiber holes and the PIN Array providing optical fiber holes both utilize the microelectromechanical system (MEMC) technology to form optical fiber holes as a concentric cylinder shape with diameter 100 ?m, height 30 ?m and diameter 130 ?m, height 80-100 ?m in the VCSEL light emitting area and the PIN light receiving area, respectively. An integrated package can be easily accomplished by mechanically performing focusing package of fixed optic-insertion to complete a glued integrated package, and thereby the package cost as a majority of the prime cost can be greatly reduced.

Abstract: A process for fabricating a micro-optical lens comprises forming a wall post structure on a substrate, coating with a polymeric film on the wall post, then making it adhering over both sides of the wall post structure by a transverse etching on the substrate around the base of posts. After an isolating process and a proper heating treatment, said polymeric film cohering to form a plano-convex lens. By controlling the respective amount of the polymeric film on both sides of said wall post structure, the polymeric film can combine with the wall post structure to form a composite material biconvex micro-lens, plano-convex micro-lens and the like. Alternatively, a single material micro-lens can be formed by imaging the profile of the polymeric micro-lens on the wall post structure via an etching process.

Abstract: A process for fabricating a micro-optical lens comprises forming a wall post structure on a substrate, coating with a high molecular weight polymeric film on the wall post, then making it adhering over both sides of the wall post structure by a transverse etching on the substrate around the base of posts. After an isolating process and a proper heating treatment, said high molecular weight polymeric film cohering to form a plano-convex lens. By controlling the respective amount of the high molecular weight polymeric film on both sides of said wall post structure, the high molecular weight polymeric film can combine with the wall post structure to form a composite material biconvex micro-lens, plano-convex micro-lens and the like. Alternatively, a single material micro-lens can be formed by imaging the profile of the high molecular weight polymeric micro-lens on the wall post structure via an etching process.

Abstract: An edge-coupled photodetector, especially a compound semiconductor edge-coupled photodetectors, has a light funnel integrated right in front of the coupling aperture for enhancing the optical coupling efficiency. The light funnel is formed utilizing either a wet etched, crystallographically defined semiconductor slope or a dry etched, resist-profile-defined semiconductor slope covered by the planarized dielectrics. The funnel internals can be partially or fully metallized for total mirror reflection. The lightwave entering the funnel and propagating along the optical axis converges through mirror reflection or total internal reflection. Through such an invention, the edge-coupled photodetector can have both high operation speed and high quantum efficiency with enlarged alignment tolerance.

Abstract: A self-aligned fabrication method utilizes dielectric planarization process for fabricating ridge waveguide semiconductor lasers. The dielectric planarization process starts with depositing a thick dielectric film onto the ridge-structured semiconductor wafer surface, and then the resulting corrugated dielectric surface is polished into a flat surface in a self-terminated manner. This dielectric flat surface is able to uniformly expose its semiconductor ridge tops by an overall etch-back process.