Abstract: The present invention is directed to a bond integrity tool, which includes a shoulder housing, a collar shaft, and an end cap. The collar shaft has a neck portion and a mouth portion. The neck portion is disposed within the shoulder housing, and the mouth portion is able to grip a test piece. The end cap communicates with the neck portion, such that when the end cap is initiated the end cap applies force on the shoulder housing, which in turn applies force on the collar shaft, which grips the test piece such that the bond integrity between the test piece and a surface may be tested.

Abstract: A single integrated fault detection apparatus and method for detecting heat-related and non-heat-related integrated circuit defects is disclosed. In one embodiment, the present invention is an apparatus comprising a first portion for detecting non-heat-related integrated circuit defects. In this embodiment, the present invention further comprises a second portion for detecting heat-related integrated circuit defects. In the present embodiment, the second portion is integrated with the first portion to provide a single integrated fault detection apparatus such that the heat-related and the non-heat-related integrated circuit defects are detectable using only a single integrated fault detection apparatus.