Patents by Inventor Chong Pei Andrew Lim

Chong Pei Andrew Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BOC BGA package for die with I-shaped bond pad layout
    Patent number: 7112048
    Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
    Type: Grant
    Filed: April 8, 2003
    Date of Patent: September 26, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang
  • BOC BGA package for die with I-shaped bond pad layout
    Patent number: 6720666
    Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
    Type: Grant
    Filed: April 8, 2003
    Date of Patent: April 13, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang
  • BOC BGA package for die with I-shaped bond pad layout
    Patent number: 6692987
    Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
    Type: Grant
    Filed: February 5, 2002
    Date of Patent: February 17, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang
  • BOC BGA package for die with I-shaped bond pad layout
    Publication number: 20030211660
    Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
    Type: Application
    Filed: April 8, 2003
    Publication date: November 13, 2003
    Applicant: Micron Technology, Inc.
    Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang
  • BOC BGA package for die with I-shaped bond pad layout
    Publication number: 20030211659
    Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
    Type: Application
    Filed: April 8, 2003
    Publication date: November 13, 2003
    Applicant: Micron Technology, Inc.
    Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang
  • BOC BGA package for die with I-shaped bond pad layout
    Publication number: 20030148557
    Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
    Type: Application
    Filed: February 5, 2002
    Publication date: August 7, 2003
    Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang